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    MICROELECTRONIC ASSEMBLIES
    4.
    发明申请
    MICROELECTRONIC ASSEMBLIES 审中-公开

    公开(公告)号：WO2019132965A1

    公开(公告)日：2019-07-04

    申请号：PCT/US2017/068913

    申请日：2017-12-29

    Applicant: INTEL CORPORATION

    Inventor： ELSHERBINI, Adel A. ,  BRAUNISCH, Henning ,  ALEKSOV, Aleksandar ,  LIFF, Shawna M. ,  SWAN, Johanna M. ,  MORROW, Patrick ,  JUN, Kimin ,  MUELLER, Brennen ,  FISCHER, Paul B.

    IPC: H01L25/065 ,  H01L23/48

    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include: a first die having a first surface and an opposing second surface, first conductive contacts at the first surface of the first die, and second conductive contacts at the second surface of the first die; and a second die having a first surface and an opposing second surface, and first conductive contacts at the first surface of the second die; wherein the second conductive contacts of the first die are coupled to the first conductive contacts of the second die by interconnects, the second surface of the first die is between the first surface of the first die and the first surface of the second die, and a footprint of the first die is smaller than and contained within a footprint of the second die.

    WAVEGUIDE CONNECTOR WITH SLOT LAUNCHER
    6.
    发明申请
    WAVEGUIDE CONNECTOR WITH SLOT LAUNCHER 审中-公开
    WAVEGUIDE连接器与插槽发射器

    公开(公告)号：WO2018063676A1

    公开(公告)日：2018-04-05

    申请号：PCT/US2017/049173

    申请日：2017-08-29

    Applicant: INTEL CORPORATION

    Inventor： ELSHERBINI, Adel A. ,  OSTER, Sasha N. ,  SWAN, Johanna M. ,  DOGIAMIS, Georgios C. ,  LIFF, Shawna M. ,  ALEKSOV, Aleksandar ,  KAMGAING, Telesphor

    IPC: H01P1/16 ,  H01P3/00 ,  H01Q13/02

    CPC classification number: H01P5/1007 ,  H01P5/10 ,  H01P5/107 ,  H01P11/00 ,  H01Q13/02

    Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a first plate and a second plate that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide.

    Abstract translation: 这里描述的系统和方法提供了一种行波发射器系统，其物理和可通信地耦合到半导体封装和波导。 行波发射器系统包括一个槽线信号转换器和一个锥形槽发射器。 槽线信号转换器可以与半导体封装整体形成并且包括将微带信号转换为槽线信号的平衡 - 不平衡转换器结构。 锥形槽发射器可通信地耦合到槽线信号转换器并且包括形成槽的第一板和第二板。 锥形槽发射器将槽线信号转换成传播到波​​导的行波信号。

    PIEZOELECTRIC PACKAGE-INTEGRATED CURRENT SENSING DEVICES
    9.
    发明申请
    PIEZOELECTRIC PACKAGE-INTEGRATED CURRENT SENSING DEVICES 审中-公开
    压电式封装集成电流检测器件

    公开(公告)号：WO2018004689A1

    公开(公告)日：2018-01-04

    申请号：PCT/US2016/040844

    申请日：2016-07-01

    Applicant: INTEL CORPORATION

    Inventor： DOGIAMIS, Georgios C. ,  ELSHERBINI, Adel A. ,  LIFF, Shawna M. ,  SWAN, Johanna ,  CULIC-VISKOTA, Jelena ,  SOUNART, Thomas L. ,  EID, Feras ,  OSTER, Sasha N.

    IPC: G01R15/14 ,  G01R31/28 ,  H01L41/047 ,  H01L41/18 ,  H01L41/083

    CPC classification number: G01R15/20 ,  G01R15/14 ,  G01R15/205 ,  G01R15/247 ,  H01L41/06 ,  H01L41/1132 ,  H01L41/125

    Abstract: Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.

    Abstract translation: 本发明的实施例包括用于感测有机衬底中的电流的电流感测装置。 电流感测装置包括释放的基底结构和定位在释放的基底结构附近的压电薄膜叠层，该释放的基底结构位于有机基底的空腔附近。 压电薄膜叠层包括与第一和第二电极接触的压电材料。 磁场被施加到电流感测装置，并且这导致释放的基础结构和压电叠堆的移动，其引起第一和第二电极之间的电压（电势差）。

    QUANTUM DOT DEVICE PACKAGES
    10.
    发明申请
    QUANTUM DOT DEVICE PACKAGES 审中-公开
    量子点设备包

    公开(公告)号：WO2017213642A1

    公开(公告)日：2017-12-14

    申请号：PCT/US2016/036327

    申请日：2016-06-08

    Applicant: INTEL CORPORATION

    Inventor： ROBERTS, Jeanette M. ,  PILLARISETTY, Ravi ,  MICHALAK, David J. ,  YOSCOVITS, Zachary R. ,  CLARKE, James S. ,  ELSHERBINI, Adel A.

    IPC: H01L29/778 ,  H01L29/12 ,  H01L29/66 ,  H01L29/80

    Abstract: Disclosed herein are quantum dot device packages, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device package may include a die having a quantum dot device, wherein the quantum dot device includes a quantum well stack, gates disposed above the quantum well stack, and conductive pathways coupled between associated ones of the gates and conductive contacts of the die. The quantum dot device package may also include a package substrate, wherein conductive contacts are disposed on the package substrate, and first level interconnects are disposed between the die and the package substrate, coupling the conductive contacts of the die with associated conductive contacts of the package substrate.

    Abstract translation: 这里公开的是量子点器件封装以及相关的计算设备和方法。 例如，在一些实施例中，量子点器件封装可以包括具有量子点器件的管芯，其中量子点器件包括量子阱堆叠，设置在量子阱堆叠上方的栅极，以及耦合在量子点中的相关联的 管芯的栅极和导电触点。 量子点器件封装还可以包括封装衬底，其中导电触点设置在封装衬底上，并且第一级互连设置在管芯和封装衬底之间，将管芯的导电触点与封装的相关导电触点耦合 基板

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