An apparatus (1) for connecting two substrates (2, 3) for an electric component features a chamber (4) for inserting the substrates (2, 3), wherein a gas inlet (13) is arranged to direct a gas (14) in the chamber (4) in a targeted manner on the surface of at least one of the substrates (2, 3). The gas inlet (13) is particularly designed to control any warping of at least one of the substrates (2, 3), which may occur during a pre-conditioning phase due to inhomogeneous heat expansion of one of the substrates (2, 3) in the bonding level, different coefficients of thermal expansion of the two substrates (2, 3) or inhomogeneous temperature distribution. Thanks to the aimed direction of the gas (14) onto the surface of at least one of the substrates (2, 3), the warping of the substrates (2, 3) may be intensified or reduced, in particular any warping of the upper substrate (3) towards the lower substrate (2) can be avoided. This allows the prevention of any direct contact of the substrates (2, 3) during the pre-conditioning phase. During the pre-conditioning phase, one or several spacers (6) can be arranged between the substrates (2, 3), the spacers (6) being removed at the end of the pre-conditioning phase. In one set-up configuration, the apparatus (1) features a measuring device (for example, a device for optical distance determination such as a camera (18) arranged at the level of a gap between the substrates (2, 3)) to determine a distance (d) between the substrates (2, 3) and/or any warping of at least one of the substrates (2, 3). The apparatus may also feature a control circuit (21) to control and readjust the flow quantity and/or the temperature of the gas (14), thus controlling the warping of the substrates (2, 3), wherein the control circuit (21) shows the measuring result of the measuring device (18) as a control variable.