Invention Application
- Patent Title: METHOD AND SYSTEM FOR MEASURING PLASMA EMISSIONS IN A PLASMA PROCESSING REACTOR
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Application No.: PCT/US2018/027636Application Date: 2018-04-13
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Publication No.: WO2018191704A1Publication Date: 2018-10-18
- Inventor: CHEN, Anthony
- Applicant: IONEER, LLC
- Applicant Address: 29 Colby Ct. Pleasanton, California 94566 US
- Assignee: IONEER, LLC
- Current Assignee: IONEER, LLC
- Current Assignee Address: 29 Colby Ct. Pleasanton, California 94566 US
- Agency: LU, Zhou
- Priority: US62/485,664 20170414
- Main IPC: H01J37/244
- IPC: H01J37/244 ; B23K26/02 ; G01N23/22 ; H01J37/02 ; H05H1/00 ; H05H1/24
Abstract:
A method of characterizing a Plasma Processing Reactor (PPR) by measuring the electromagnetic (EM) emissions of a plasma inside the PPR using an Optical Plasma Monitoring Apparatus (OPMA) is described. The OPMA contains a plurality of photo-sensors that can measure EM emissions of narrow and/or broad spectral regions at various selected positions on the OPMA, and record them as a function of time. The OPMA can have substantially similar dimensions of a workpiece to facilitate loading and unloading into the PPR.
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