Abstract:
A method of characterizing a Plasma Processing Reactor (PPR) by measuring the electromagnetic (EM) emissions of a plasma inside the PPR using an Optical Plasma Monitoring Apparatus (OPMA) is described. The OPMA contains a plurality of photo-sensors that can measure EM emissions of narrow and/or broad spectral regions at various selected positions on the OPMA, and record them as a function of time. The OPMA can have substantially similar dimensions of a workpiece to facilitate loading and unloading into the PPR.
Abstract:
Various examples of the present technology disclose a self-contained and programmable Processing Probe Apparatus (PPA) that can measure processing properties of a processing tool. The PPA comprises one or more sensors, an analog-to-digital converter and information (ADCI) processor, an electrical power source (EPS), and a digital signal communication device, all of which are attached to a flexible film. The flexible film can be mounted on a substrate that mimics a semiconductor workpiece.