A device for making through holes in ceramic slabs, comprising: a laser source (20), set up for emitting a laser beam (21); focusing means (30) set up for focusing the laser beam (21) on a preset area or spot (S); motor means, set up for determining a translation of a slab (T) to be cut and/or of the spot (S) along a cutting direction (X) such that, for a preset interval of time, the corresponding movement between the slab (T) and the spot (S) along the cutting direction (X) is nil.