Invention Application
- Patent Title: PHOTONIC CHIP AND METHOD OF MANUFACTURE
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Application No.: PCT/EP2019/086429Application Date: 2019-12-19
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Publication No.: WO2020127812A1Publication Date: 2020-06-25
- Inventor: REED, Graham , THOMSON, David
- Applicant: UNIVERSITY OF SOUTHAMPTON
- Applicant Address: Highfield Southampton Hampshire SO17 1BJ GB
- Assignee: UNIVERSITY OF SOUTHAMPTON
- Current Assignee: UNIVERSITY OF SOUTHAMPTON
- Current Assignee Address: Highfield Southampton Hampshire SO17 1BJ GB
- Agency: MEWBURN ELLIS LLP
- Priority: GB1820963.5 20181221
- Main IPC: G02B6/122
- IPC: G02B6/122 ; G02B6/12 ; G02B6/13
Abstract:
A silicon photonic chip is provided comprising a top silicon device layer; an insulating layer beneath the top silicon device layer; an intermediate silicon device layer beneath the insulating layer; a further insulating layer beneath the intermediate silicon device layer; a silicon substrate beneath the further insulating layer; and a first silicon waveguide, the first silicon waveguide being partially formed by a portion of the intermediate silicon device layer.
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