发明申请
- 专利标题： MOLDED SUBSTRATES
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申请号： PCT/US2019/054862申请日： 2019-10-04
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公开(公告)号： WO2021066845A1公开(公告)日： 2021-04-08
- 发明人: CUMBIE, Michael Wayne , SCHWEITZER, Paul David , STUDER, Anthony Donald , LUTNESKY, Gary Gerard , DAVIS, John Edward
- 申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 申请人地址： 10300 Energy Drive
- 专利权人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人地址： 10300 Energy Drive
- 代理机构： PERRY, Garry A. et al.
- 主分类号： B41J2/16
- IPC分类号： B41J2/16 ; B29C45/00 ; B81C1/00 ; H01L21/56 ; B29C45/14 ; H01L21/683 ; H01L23/00
摘要：
Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.
IPC分类:
