Invention Application
- Patent Title: METHOD FOR FORMING COMPONENTS WITHOUT ADDING TABS DURING ETCHING
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Application No.: PCT/US2021/017470Application Date: 2021-02-10
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Publication No.: WO2021163202A1Publication Date: 2021-08-19
- Inventor: OLSEN, Clark, T. , RIBAR, Jeffery, G.
- Applicant: HUTCHINSON TECHNOLOGY INCORPORATED
- Applicant Address: 40 West Highland Park Drive NE
- Assignee: HUTCHINSON TECHNOLOGY INCORPORATED
- Current Assignee: HUTCHINSON TECHNOLOGY INCORPORATED
- Current Assignee Address: 40 West Highland Park Drive NE
- Agency: MOONEY, Christopher, M.
- Priority: US17/171,886 2021-02-09
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/47 ; H01L21/48 ; H01L21/683
Abstract:
A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.
Information query
IPC分类:
