The present invention is a method for manufacturing a carrier for a double-side polishing device that has an upper surface plate and a lower surface plate with polishing cloths adhered thereto, said carrier having a carrier base material and a resin insert, said carrier base material having a retention hole formed therein for retaining a wafer, and said resin insert being positioned along an inner circumference surface of the retention hole and having an inner circumference section formed therein that contacts an outer circumference section of the wafer. This method for manufacturing a carrier for a double-side polishing device has: a preparation step in which the carrier base material and the resin insert, which is thicker than the carrier base material, are prepared; a forming step in which the resin insert is formed on the inner circumference surface of the retention hole in an unbonded manner and so as to have a peel strength of 10N to 50N; and a startup polishing step in which the double-side polishing device is used to perform startup polishing, with a multi-level load of two or more levels, of the carrier that comprises the carrier base material and the resin insert. Accordingly, the present invention provides a manufacturing method for a carrier for a double-side polishing device wherein obverse/reverse discrepancy in the level difference between the resin insert and the carrier base material in the carrier for a double-side polishing device can be reduced.