Invention Application
- Patent Title: THIN LAYER DEPOSITION WITH PLASMA PULSING
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Application No.: PCT/US2021/036933Application Date: 2021-06-11
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Publication No.: WO2021257390A1Publication Date: 2021-12-23
- Inventor: TRINH, Cong , MALDONADO-GARCIA, Maribel , BALSEANU, Mihaela A. , GARACHTCHENKO, Alexander V. , TANAKA, Tsutomu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: 3050 Bowers Avenue
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: 3050 Bowers Avenue
- Agency: WHITNEY, Karen M.
- Priority: US17/343,866 2021-06-10
- Main IPC: H01L45/00
- IPC: H01L45/00 ; C23C16/30 ; C23C16/56 ; C23C16/0245 ; C23C16/345 ; C23C16/45536 ; C23C16/45538 ; C23C16/45546 ; C23C16/505 ; C23C16/52 ; H01L21/02104
Abstract:
Methods of depositing thin films for an electronic device, for example a semiconductor device include applying a first pulsed plasma with or without a reactant and a second continuous plasma with a reactant.
Information query
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