Provided is a polishing pad which has a high tracking performance even if a surface to be polished is a curved surface. A polishing pad (1) according to an embodiment of the present invention is provided with a polishing layer (2) having a polishing surface (21), and a supporting layer (3) which comprises a material softer than the polishing layer (2), and which is fixed to a surface (22) on the opposite side of the polishing layer (2) to the polishing surface (21), wherein the hardness of the supporting layer (3) is an F hardness of at least 30 and less than 70.