Invention Application
- Patent Title: ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION FOR BONDING SOLAR CELLS
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Application No.: PCT/CN2021/115002Application Date: 2021-08-27
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Publication No.: WO2023024071A1Publication Date: 2023-03-02
- Inventor: DUAN, Shasha , FU, Jibing , LIU, Yong , DONG, Bo , WU, Junxi , FANG, Lei
- Applicant: HENKEL AG & CO. KGAA , HENKEL (CHINA) CO., LTD.
- Applicant Address: Henkelstr. 67; No. 189 Guo Yuan Road, Zhu Qiao Town, Pu Dong New Area
- Assignee: HENKEL AG & CO. KGAA,HENKEL (CHINA) CO., LTD.
- Current Assignee: HENKEL AG & CO. KGAA,HENKEL (CHINA) CO., LTD.
- Current Assignee Address: Henkelstr. 67; No. 189 Guo Yuan Road, Zhu Qiao Town, Pu Dong New Area
- Agency: NTD PATENT & TRADEMARK AGENCY LIMITED
- Main IPC: H01B1/22
- IPC: H01B1/22 ; H02S40/36
Abstract:
The present invention provides an electrically conductive adhesive composition comprising (A) at least one non-toughened epoxy resin, (B) optionally at least one toughened epoxy resin, (C) at least one imidazole compound, (D) at least one latent amine curing agent other than imidazole compound, (E) at least one silver filler having a D50 particle size of no more than 20 μm, and (F) at least one silver filler having a D50 particle size of from 20 to 100 μm.
Information query
