公开(公告)号：WO2020232623A1

公开(公告)日：2020-11-26

申请号：PCT/CN2019/087755

申请日：2019-05-21

Applicant: HENKEL AG & CO. KGAA ,  HENKEL (CHINA) CO., LTD. ,  HENKEL (CHINA) INVESTMENT CO., LTD. ,  HENKEL LOCTITE (CHINA) CO., LTD. ,  ABLESTIK (SHANGHAI) LTD.

Inventor： ZHANG, JiaYun ,  LIU, Yong ,  FU, JiBing ,  ZHAO, Lin ,  WU, JunXi ,  YUE, Qi ,  NI, KeFan

IPC: H01L31/05 ,  H01L31/18

Abstract: The present disclosure provides a rework device and a rework method. The rework device includes a first supporting component, a second supporting component and a heating component disposed between the first supporting component and the second supporting component and being in flush with the second supporting component. The first supporting component is inclined at an angle with respect to the heating component. This type of rework device and rework method has the advantages of simple structure, low cost and convenient operation.

公开(公告)号：WO2023024071A1

公开(公告)日：2023-03-02

申请号：PCT/CN2021/115002

申请日：2021-08-27

Applicant: HENKEL AG & CO. KGAA ,  HENKEL (CHINA) CO., LTD.

Inventor： DUAN, Shasha ,  FU, Jibing ,  LIU, Yong ,  DONG, Bo ,  WU, Junxi ,  FANG, Lei

IPC: H01B1/22 ,  H02S40/36

Abstract: The present invention provides an electrically conductive adhesive composition comprising (A) at least one non-toughened epoxy resin, (B) optionally at least one toughened epoxy resin, (C) at least one imidazole compound, (D) at least one latent amine curing agent other than imidazole compound, (E) at least one silver filler having a D50 particle size of no more than 20 μm, and (F) at least one silver filler having a D50 particle size of from 20 to 100 μm.