公开(公告)号：WO2023024071A1

公开(公告)日：2023-03-02

申请号：PCT/CN2021/115002

申请日：2021-08-27

Applicant: HENKEL AG & CO. KGAA ,  HENKEL (CHINA) CO., LTD.

Inventor： DUAN, Shasha ,  FU, Jibing ,  LIU, Yong ,  DONG, Bo ,  WU, Junxi ,  FANG, Lei

IPC: H01B1/22 ,  H02S40/36

Abstract: The present invention provides an electrically conductive adhesive composition comprising (A) at least one non-toughened epoxy resin, (B) optionally at least one toughened epoxy resin, (C) at least one imidazole compound, (D) at least one latent amine curing agent other than imidazole compound, (E) at least one silver filler having a D50 particle size of no more than 20 μm, and (F) at least one silver filler having a D50 particle size of from 20 to 100 μm.