发明申请
- 专利标题： FAN-OUT PACKAGE WITH ANTENNA
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申请号： PCT/US2022/044185申请日： 2022-09-21
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公开(公告)号： WO2023049142A1公开(公告)日： 2023-03-30
- 发明人: TANG, Yiqi , MURUGAN, Rajen, Manicon
- 申请人： TEXAS INSTRUMENTS INCORPORATED
- 申请人地址： P. O. Box 655474, Mail Station 3999
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： P. O. Box 655474, Mail Station 3999
- 代理机构： BRILL, Charles, A. et al.
- 优先权： US17/689,153 2022-03-08
- 主分类号： H01L23/66
- IPC分类号： H01L23/66 ; H01L23/00 ; H01L23/482
摘要：
An electronic device (100) includes a die (108), a packages structure (120), and a multilevel redistribution structure (110) having a first via (111), a first level, a second via (113), a second level, and passivation material (119). The first level (111) has a conductive antenna (130), the first via (111) extends between the conductive antenna (130) and a conductive terminal (109) of the die (108), and the passivation material (119) extends between the first and second levels. The second via (113) extends through the passivation material (119) between the first and second levels. The second level has a conductive reflector (138).
IPC分类:
