A heat dissipation member according to the present invention comprises a planar metal-silicon carbide composite that contains aluminum. The heat dissipation member further comprises: at least one through-hole passing through the planar metal-silicon carbide composite in the thickness direction; a taper portion where the inner diameter of the through-hole gradually increases toward the outer side on the perimeter of one or both ends of the through-hole; a metal portion containing aluminum and formed on the surface of the interior of the through-hole; and a screw hole formed in the metal portion.