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公开(公告)号：EP0981152A3
公开(公告)日：2004-01-02
申请号：EP99306116.7
申请日：1999-08-02
CPC分类号： H01L21/67132 , H01L21/6838 , H01L2224/75 , H01L2224/7565 , Y10T29/53191
摘要： The specification describes a method for dispensing IC chips from a chip carrier tape for a flip-chip assembly operation. In a conventional assembly operation, the solder bumped side of the chip is the top side of the chip as loaded on the tape, and is normally the side of the chip that engages the head of the pick tool. For flip-chip assembly it is necessary to invert the chip for solder bonding to an interconnect substrate. In the technique of the invention, the chip carrier tape is inverted and inserted into the dispensing machine upside down. The IC chips are then ejected through the back of the tape instead of being lifted from the from of the tape. In this way the pick tool head engages the back side of the solder bumped chip and the chip is in the proper orientation for flip-chip placement and bonding on the interconnect substrate. Carrier tapes designed for through-tape dispensing are also disclosed.
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公开(公告)号：EP0981152B1
公开(公告)日：2010-12-01
申请号：EP99306116.7
申请日：1999-08-02
CPC分类号： H01L21/67132 , H01L21/6838 , H01L2224/75 , H01L2224/7565 , Y10T29/53191
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公开(公告)号：EP0981152A2
公开(公告)日：2000-02-23
申请号：EP99306116.7
申请日：1999-08-02
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/6838 , H01L2224/75 , H01L2224/7565 , Y10T29/53191
摘要： The specification describes a method for dispensing IC chips from a chip carrier tape for a flip-chip assembly operation. In a conventional assembly operation, the solder bumped side of the chip is the top side of the chip as loaded on the tape, and is normally the side of the chip that engages the head of the pick tool. For flip-chip assembly it is necessary to invert the chip for solder bonding to an interconnect substrate. In the technique of the invention, the chip carrier tape is inverted and inserted into the dispensing machine upside down. The IC chips are then ejected through the back of the tape instead of being lifted from the from of the tape. In this way the pick tool head engages the back side of the solder bumped chip and the chip is in the proper orientation for flip-chip placement and bonding on the interconnect substrate. Carrier tapes designed for through-tape dispensing are also disclosed.
摘要翻译： 该说明书描述了用于从用于倒装芯片组装操作的芯片载带分配IC芯片的方法。 在常规组装操作中，芯片的焊料凸起侧是装载在带上的芯片的顶侧，并且通常是芯片的接合拾取工具头部的一侧。 对于倒装芯片组装，需要将用于焊接焊接的芯片反转到互连衬底。 在本发明的技术中，芯片载带被倒置并倒置插入分配机。 然后将IC芯片从带的背面排出，而不是从带子上提起。 以这种方式，拾取工具头接合焊料凸起的芯片的背面，并且芯片处于适当的取向以便在互连衬底上进行倒装芯片放置和结合。 还公开了用于通过胶带分配的载带。
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