公开(公告)号：EP4421855A2

公开(公告)日：2024-08-28

申请号：EP24156576.1

申请日：2024-02-08

申请人： Nexperia B.V.

发明人： Wesselingh, Jasper

IPC分类号： H01L21/67 ,  H01L21/683

CPC分类号： H01L21/67132 ,  H01L21/67144 ,  H01L21/6836 ,  H01L2221/6836320130101 ,  H01L2221/6838120130101 ,  H01L2221/6832220130101

摘要： Aspects of the present disclosure relate to an electronic component transfer system. Further aspects of the present disclosure relate to a method for transferring an electronic component. The present disclosure particularly relates to electronic component transfer systems in which an optical light source is used for releasing and transferring electronic components.
According to an aspect of the present disclosure, a drive unit is used for moving the optical light source and/or light beam output by the optical light source to change a position at which it has released a component from the source substrate to a position at which it will release a next component from the source substrate.

公开(公告)号：EP4421854A1

公开(公告)日：2024-08-28

申请号：EP23158086.1

申请日：2023-02-22

申请人： Nexperia B.V.

发明人： van de Rijdt, Johannes Hubertus Antonius ,  Wesselingh, Jasper

IPC分类号： H01L21/67 ,  H01L21/683

CPC分类号： H01L21/67132 ,  H01L21/67144 ,  H01L21/6836 ,  H01L2221/6836320130101 ,  H01L2221/6838120130101 ,  H01L2221/6832220130101

摘要： Aspects of the present disclosure relate to an electronic component transfer system. Further aspects of the present disclosure relate to a method for transferring an electronic component. The present disclosure particularly relates to electronic component transfer systems in which an optical light source is used for releasing and transferring electronic components.
According to an aspect of the present disclosure, a drive unit is used for moving the optical light source and/or light beam output by the optical light source to change a position at which it has released a component from the source substrate to a position at which it will release a next component from the source substrate.

公开(公告)号：EP4358121A1

公开(公告)日：2024-04-24

申请号：EP22202269.1

申请日：2022-10-18

申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO

发明人： HENDRIKS, Rob Jacob ,  KOLDEWEIJ, Robin Bernardus Johannes

IPC分类号： H01L21/67 ,  H01L21/683

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/67103 ,  H01L2221/6838120130101 ,  H01L2221/6835420130101 ,  H01L2221/6836320130101 ,  H01L2221/6832220130101

摘要： A deposition device (1) is disclosed herein for depositing components (Ca, Cb,..) on a target surface (TS) of a target (T), the deposition device comprises a donor plate (3), at least one heater element (33), a power supply (6), a target manipulation device and a controller (5) configured for controlling the power supply (6) and the target manipulation device (2;21, 22). The controller causes the power supply (6) to supply at least a first pulse (Pulse 1) of electric power to the at least one heater element (33) in a zone (32) to heat the donor plate surface (31s) in at least a first subzone (32a) of that zone to a surface temperature exceeding a threshold temperature of an adhesive specimen (7a) in said first subzone (32a). Subsequent to a change of a lateral position of the target (T) relative to the donor plate (3), the controller causes the power supply (6) to supply at least a second pulse (Pulse 2) of electric power to the heater element to heat the donor plate surface (31s) in at least a second subzone (32b) to a surface temperature exceeding a threshold temperature of the adhesive specimen (7b) in said second subzone (32b). Therewith components within a zone sharing a same heater element can be transferred independently from each other.

公开(公告)号：EP2928700B1

公开(公告)日：2018-09-12

申请号：EP13860728.8

申请日：2013-12-06

申请人： AIXTRON SE

发明人： WILLNER, Bruce, Ira

IPC分类号： B44C3/08 ,  B28B19/00

CPC分类号： B32B37/24 ,  B32B38/08 ,  B32B38/10 ,  B32B2037/243 ,  B32B2037/246 ,  C01B32/184 ,  C01B32/194 ,  H01L21/0201 ,  H01L21/67092 ,  H01L21/67132

摘要： A method is disclosed which includes: forming at least one layer of material on at least part of a surface of a first substrate, wherein a first surface of the at least one layer of material is in contact with the first substrate thereby defining an interface; attaching a second substrate to a second surface of the at least one layer of material; forming bubbles at the interface; and applying mechanical force; whereby the second substrate and the at least one layer of material are jointly separated from the first substrate. Related arrangements are also described.

公开(公告)号：EP2581934B1

公开(公告)日：2018-08-15

申请号：EP12188485.2

申请日：2012-10-15

申请人： APPLIED MATERIALS ITALIA S.R.L.

发明人： Baccini, Andrea ,  Gajotto, Marco ,  Micheletti, Thomas ,  Tonini, Diego ,  Telle, John ,  Maiolini, Marco ,  Sartoretto, Andrea

IPC分类号： H01L21/677 ,  B65G49/06 ,  C23C16/54 ,  B23K26/36 ,  H01L21/67

CPC分类号： H01L31/18 ,  B32B17/10018 ,  B32B17/10788 ,  B32B17/10807 ,  H01L21/67132 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67236 ,  H01L21/67712 ,  H01L21/67718 ,  H01L21/67721 ,  H01L21/67727 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67754 ,  H01L31/048 ,  H01L31/1876 ,  H01L31/188 ,  Y02E10/50 ,  Y10T29/5317 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261

摘要： Embodiments of the invention may provide a system for the production of photovoltaic modules that comprises at least a first work line having a plurality of positioning stations in which a series of first processing operations are performed and a second work line consisting of at least a positioning station in which at least a second processing operation is performed. The process sequence may include, for example, printing a layer material used to form one or more electric contacts on a base layer, and then positioning photovoltaic cells and various layers of insulating material in a desired orientation over the base layer to form a photovoltaic module.

公开(公告)号：EP2575163A3

公开(公告)日：2017-12-27

申请号：EP12191692.8

申请日：2011-04-15

申请人： Suss MicroTec Lithography GmbH

发明人： George, Gregory

IPC分类号： H01L21/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/68 ,  B32B43/00 ,  B32B38/18

CPC分类号： B32B43/006 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67103 ,  H01L21/67132 ,  H01L21/68 ,  H01L21/6835 ,  H01L21/6838 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381

摘要： A debonder apparatus 600) for debonding a temporary bonded wafer pair (10) includes a chuck assembly, a flex plate assembly, a contact roller (260) and a resistance roller (610). The chuck assembly includes a chuck and a first wafer holder configured to hold a first wafer of the temporary bonded wafer pair (10) in contact with a top surface of the chuck. The flex plate assembly includes a flex plate (253) and a second wafer holder configured to hold a second wafer of the temporary bonded wafer pair (10) in contact with a first surface of the flex plate. The flex plate (253) is configured to be placed above the top surface of the chuck. The contact roller (260) is arranged adjacent to a first edge of the chuck and includes means for pushing and lifting up a first edge of the flex plate. The resistance roller (610) includes means for traversing horizontally over the flex plate and means for applying a downward force upon the flex plate. The contact roller (260) pushes and lifts up the first edge of the flex plate while the resistance roller (610) simultaneously applies the downward force upon the flex plate (253) and traverses horizontally away from the first edge of the flex plate and thereby the temporary bonded wafer pair (10) delaminates along a release layer and the first and second wafers are separated from each other.

摘要翻译： 用于松开临时结合晶片对（10）的松解装置600包括卡盘组件，柔性板组件，接触辊（260）和阻力辊（610）。 卡盘组件包括卡盘和第一晶片保持器，该第一晶片保持器构造成保持临时接合晶片对（10）的第一晶片与卡盘的顶表面接触。 挠性板组件包括挠性板（253）和第二晶圆保持器，该第二晶圆保持器被构造成保持临时接合晶圆对（10）的第二晶圆与挠性板的第一表面接触。 挠性板（253）构造成放置在卡盘的顶表面上方。 接触辊（260）布置在卡盘的第一边缘附近并且包括用于推动和提升柔性板的第一边缘的装置。 阻力辊（610）包括用于在挠性板上水平横移的装置和用于在挠性板上施加向下的力的装置。 当阻力辊（610）同时向挠性板（253）施加向下的力并且从挠性板的第一边缘水平地横向穿过并由此抵接辊（260）推动并提升挠性板的第一边缘 临时接合晶片对（10）沿着释放层分层并且第一和第二晶片彼此分离。

公开(公告)号：EP3234992A1

公开(公告)日：2017-10-25

申请号：EP17706956.4

申请日：2017-01-23

申请人： JENOPTIK Optical Systems GmbH

发明人： PANITZ, Meik

IPC分类号： H01L21/683 ,  H01L21/67 ,  H05K13/04 ,  H01L23/00 ,  H01L21/677

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/6831 ,  H01L24/97

摘要： The invention relates to a method and to an apparatus for separating a microchip (2) from a wafer (1) and applying the microchip (2) to a substrate (6), wherein during the removal the microchip (2) is wrung onto the free end (5.1.1) of a tip (5.1) and thus adheres to the tip (5.1) by adhesion force during transport to the substrate (6). A co-ordinate measuring assembly may advantageously be used as the apparatus.

摘要翻译： 本发明涉及用于从晶片（1）分离微芯片（2）并且将微芯片（2）施加到衬底（6）的方法和设备，其中在移除期间，微芯片（2）被拧到 （5.1）的自由端（5.1.1），并因此在运输到基板（6）期间通过粘合力粘附到尖端（5.1）。 坐标测量组件可以有利地用作该设备。

公开(公告)号：EP2577720A4

公开(公告)日：2017-04-12

申请号：EP11787385

申请日：2011-05-26

申请人： SUSS MICROTEC LITHOGRAPHY GMBH

发明人： GEORGE GREGORY

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L2221/68327 ,  H01L2221/68381

摘要： An apparatus for removing an adhesive layer from a wafer surface includes a chuck, a contact roller, a pick-up roller and a detaping tape. The chuck supports and holds a wafer that has an adhesive layer on its top surface. The contact roller rotates around a first axis and moves linearly along a direction perpendicular to the first axis over the chuck and the supported wafer. The pick-up roller rotates around a second axis, that is parallel to the first axis. The detaping tape rolls around the contact roller and the pick-up roller, and as it rolls it attaches to the adhesive layer, and then is removed together with the adhesive layer. The contact roller has a surface that has a footprint of a circle when rolled along a flat surface.

公开(公告)号：EP2706561B1

公开(公告)日：2017-04-05

申请号：EP13195920.7

申请日：2009-09-01

申请人： EV Group GmbH

发明人： Lindner, Friedrich Paul ,  Burggraf, Jürgen

IPC分类号： H01L21/67 ,  H01L21/683

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B43/003 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/6839 ,  Y10S156/93 ,  Y10S156/941 ,  Y10S156/942 ,  Y10T156/11 ,  Y10T156/1111 ,  Y10T156/1121 ,  Y10T156/1184 ,  Y10T156/19 ,  Y10T156/1922 ,  Y10T156/1961 ,  Y10T156/1967

公开(公告)号：EP1869701B1

公开(公告)日：2017-02-08

申请号：EP06742229.5

申请日：2006-04-10

申请人： Pac Tech - Packaging Technologies GmbH

发明人： ZAKEL, Elke ,  AZDASHT, Ghassem

IPC分类号： H01L21/67 ,  H01L23/00 ,  H01L21/683

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6836 ,  H01L24/31 ,  H01L24/75 ,  H01L24/83 ,  H01L24/86 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/75 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/7965 ,  H01L2224/81005 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2924/00014