METHOD OF PLATING NONCONDUCTOR PRODUCT
    5.
    发明公开
    METHOD OF PLATING NONCONDUCTOR PRODUCT 有权
    VERFAHREN ZUM BESCHICHTEN EINES NICHTLEITERPRODUKTS

    公开(公告)号:EP1445347A1

    公开(公告)日:2004-08-11

    申请号:EP02762884.1

    申请日:2002-08-28

    IPC分类号: C23C18/20

    摘要: A nonconductor product is soaked in a solution suspending semiconducting powder and is subjected to light irradiation in the solution so that the polar group is formed on the surface of the nonconductor product, and then electroless plating is performed on the surface on which the polar group is formed. A resin product is subjected to electroless plating after ultraviolet treatment in which ultraviolet rays are irradiated through water or a solution is performed. Further, electroless plating or electroplating with a different or the same kind of metal is performed on the electroless-plated layer formed by electroless plating. With the method like this, the plated nonconductor product which does not cause the problems such as environmental pollution and waste liquid treatment, and whose surface and the plated coating is firmly adhered to each other, and, when a resin product is used as a subject to be plated, deformation by heat of the resin product can be prevented, and moreover, adherent strength of the plated coating can be improved.

    摘要翻译: 将非导体产物浸泡在悬浮半导体粉末的溶液中,并在溶液中进行光照射,使得极性基团形成在非导体产品的表面上,然后在极性基团的表面上进行无电镀 形成。 紫外线处理后,通过水或溶液照射紫外线,对树脂制品进行化学镀。 此外,在通过化学镀形成的化学镀层上进行化学镀或具有不同或相同种类的金属的电镀。 采用这样的方法,不会引起诸如环境污染和废液处理等问题的电镀非导体产品,并且其表面和镀层彼此牢固地粘合,并且当将树脂产品用作主体 可以防止树脂制品的热变形,并且可以提高镀覆层的粘附强度。