公开(公告)号：EP2465974B1

公开(公告)日：2018-11-28

申请号：EP11193193.7

申请日：2011-12-13

申请人： Rohm and Haas Electronic Materials LLC

发明人： Liu, Feng ,  Rzeznik, Maria Anna

IPC分类号： C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/18 ,  B01J13/00 ,  C23C18/40

CPC分类号： C23C18/40 ,  B01J13/0034 ,  B01J13/0043 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1653 ,  C23C18/1879 ,  C23C18/1893 ,  C23C18/206 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/405

摘要： Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

公开(公告)号：EP2896720A1

公开(公告)日：2015-07-22

申请号：EP13837102.6

申请日：2013-09-12

申请人： Nissan Chemical Industries, Ltd.

发明人： SAITO, Daigo ,  KOJIMA, Keisuke

IPC分类号： C23C18/30

CPC分类号： C23C18/31 ,  C23C18/165 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/30

摘要： It is an object of the present invention to provide a novel primer for use in pretreatment steps in electroless plating which is environmentally friendly, by which process is easy with fewer steps, and which can realize cost reduction. A primer for forming a metal plating film on a base material by electroless plating, the primer comprising: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; a metal fine particle; and an alkoxysilane.

摘要翻译： 本发明的目的是提供一种用于化学镀中的预处理步骤的新型底漆，其是环境友好的，通过该步骤，步骤容易，并且可以实现成本降低。 一种用于通过化学镀在基材上形成金属电镀膜的底漆，所述底漆包括：在分子末端具有铵基并且重均分子量为500至5,000,000的超支化聚合物; 金属微粒; 和烷氧基硅烷。

公开(公告)号：EP2698448A4

公开(公告)日：2015-01-07

申请号：EP12772017

申请日：2012-04-11

申请人： NISSAN CHEMICAL IND LTD

发明人： KOJIMA KEISUKE

IPC分类号： C23C18/18 ,  C08F12/26 ,  C08F12/30 ,  C08F12/32 ,  C08G61/00 ,  C08G83/00 ,  C09D125/06 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  C23C18/30 ,  C23C18/32 ,  C23C18/42 ,  C23C18/44

CPC分类号： C09D125/06 ,  C08F12/26 ,  C08F12/30 ,  C08F12/32 ,  C08F2438/03 ,  C08G83/006 ,  C08J7/047 ,  C08J2367/02 ,  C08J2400/202 ,  C08L101/005 ,  C23C18/1608 ,  C23C18/1831 ,  C23C18/1834 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/52 ,  Y10T428/12063

摘要： There is provided a novel, environmentally friendly primer for use in the pretreatment steps in electroless plating, which can be easily used in fewer steps with a lower cost. A primer for forming a metallic plating film on a substrate by electroless plating, the primer comprising: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; and a metal fine particle.

公开(公告)号：EP2770084A1

公开(公告)日：2014-08-27

申请号：EP14155035.0

申请日：2014-02-13

申请人： Rohm and Haas Electronic Materials LLC

发明人： Kwong, Suk Kwan ,  Zhou, Weijuan ,  Zhou, Wenjia ,  Chan, Dennis Chit Yiu, Rohm and Haas Electronic Materials LLC., ,  Yee, Dennis Kwok Wai

IPC分类号： C23C18/30 ,  B01J23/44 ,  B01J35/00 ,  C09D11/00

CPC分类号： C23C18/31 ,  B01J23/38 ,  B01J23/44 ,  B01J23/50 ,  B01J31/06 ,  B01J35/0013 ,  B01J37/0217 ,  B01J37/0219 ,  B01J37/16 ,  C23C18/1831 ,  C23C18/1834 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/38 ,  H05K3/185 ,  H05K3/381 ,  H05K3/422 ,  H05K2201/0257 ,  H05K2203/0766 ,  H05K2203/0783 ,  H05K2203/095

摘要： A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has π electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.

摘要翻译： 包括贵金属纳米粒子和由至少两种单体聚合的聚合物的溶液，（1）具有两个或更多个羧基或羧酸盐基团的单体和（2）具有π电子可得特征的单体。 该解决方案对于在非导电表面上化学镀金属的工艺的催化剂是有用的。

公开(公告)号：EP1871826A4

公开(公告)日：2011-08-17

申请号：EP06731349

申请日：2006-03-31

申请人： FUJIFILM CORP

发明人： KAWAMURA KOICHI ,  SATO HIROSHI

IPC分类号： C08J7/04 ,  C08F292/00 ,  H01B5/14 ,  H05K1/03 ,  H05K3/06

CPC分类号： H05K3/387 ,  B32B3/14 ,  B32B3/18 ,  B32B3/266 ,  B32B5/142 ,  B32B15/092 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/285 ,  B32B27/308 ,  B32B27/38 ,  B32B2307/202 ,  B32B2307/538 ,  B32B2307/728 ,  B32B2457/08 ,  C08F289/00 ,  C08F290/06 ,  C08F290/14 ,  C08F291/18 ,  C08F292/00 ,  C08J7/047 ,  C08J2451/00 ,  C08L51/08 ,  C23C18/206 ,  C23C18/2086 ,  C23C18/30 ,  H05K2203/1163 ,  H05K2203/1168 ,  Y10T428/24802 ,  Y10T428/31504 ,  C08L2666/02

公开(公告)号：EP2133200A1

公开(公告)日：2009-12-16

申请号：EP08703111.8

申请日：2008-01-11

申请人： Fujifilm Corporation

发明人： TSURUMI, Mitsuyuki ,  UEKI, Shiki

IPC分类号： B32B27/00 ,  B32B15/08 ,  C08J7/04 ,  C23C18/16 ,  C25D5/56 ,  H05K1/03

CPC分类号： H05K3/387 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/1658 ,  C23C18/206 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/26 ,  C23C18/285 ,  C23C18/30 ,  C25D5/56 ,  H05K1/0393 ,  H05K3/105 ,  H05K3/426 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/121 ,  Y10T156/1052 ,  Y10T156/1062

摘要： The invention provides a conductive substance-adsorbing resin film on which a conductive layer being excellent in adhesion to the resin film and having less unevenness at the interface with the resin film can easily be formed, a method for producing the same, a metal layer-coated resin film on which a high definition wiring excellent in adhesion to the insulating resin film can easily be formed, which is obtained by using the conductive substance-adsorbing resin film of the invention, and a method for producing a metal layer-coated resin film that is a material capable of easily producing a printed-wiring board having a high definition wiring. The invention also provides a conductive substance-adsorbing resin film including at least two resin layers, wherein at least one of the resin layers is an adsorbing resin layer having a property of adsorbing a conductive substance or a metal. This conductive substance-adsorbing resin film is allowed to adsorb a metal and subjected to plating, whereby a metal layer-coated resin film can be obtained.

摘要翻译： 本发明提供一种导电性物质吸附树脂膜在其上的导电层具有优良的粘合性树脂薄膜和在与树脂的界面具有较小的不均匀性膜可以容易地形成，其制造方法，金属层 涂覆的树脂膜在其上的高清晰度布线粘合性优异的绝缘树脂膜可以容易地形成，所有这一切是通过使用导电性物质吸附树脂上的本发明薄膜的获得，以及一种用于制造金属涂覆层的树脂成膜的方法 确实是一种能够容易地制造具有高清晰度的布线的印刷电路板材料。 因此本发明提供一种导电性物质吸附性树脂薄膜，包括至少两个树脂层，worin树脂层中的至少一个是具有吸附导电性物质或金属的性质的吸附性树脂层。 这种导电性物质吸附树脂薄膜被允许吸附在金属和进行镀覆，由此涂覆的金属层的树脂膜可以得到。

公开(公告)号：EP2113037A1

公开(公告)日：2009-11-04

申请号：EP07851949.3

申请日：2007-12-21

申请人： Nederlandse Centrale Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO

发明人： KAASJAGER, Anton ,  HOVESTAD, Arjan ,  JAGER, Hein

IPC分类号： C23C18/30

CPC分类号： C23C18/1608 ,  C23C18/2006 ,  C23C18/206 ,  C23C18/30 ,  C23C18/31 ,  D06M10/025 ,  D06M10/06 ,  D06M11/83 ,  D06M23/16 ,  Y10T428/24917

摘要： The invention is directed to a method for preparing a partly metallised fibrous web, to a partly metallised fibrous web, and to the use thereof. The method of the invention comprises subjecting one or more pre-determined parts of the fibrous web to a plasma treatment; applying catalyst to at least the one or more plasma treated parts of the fibrous web; and metallising the one or more pre-determined parts of the fibrous web by contacting at least the one or more pre-determined parts of the fibrous web with metal ions and a reducing agent. The invention further describes a method for controlling migration of the chemicals in a process for preparing a partly metallised fibrous web by providing the fibrous web with a hydrophobic/hydrophilic pattern.

公开(公告)号：EP1877263A1

公开(公告)日：2008-01-16

申请号：EP06725324.5

申请日：2006-03-27

申请人： AGFA-GEVAERT

发明人： LEENDERS, Luc AGFA-GEVAERT Corporate IP Dept. 3800 ,  WERTS, Michel AGFA-GEVAERT Corporate IP Dept. 3800

IPC分类号： B41N3/08 ,  H05K3/18 ,  C23C18/16

CPC分类号： C23C18/1608 ,  B41M1/04 ,  B41M1/10 ,  B41M3/006 ,  C23C18/1692 ,  C23C18/1831 ,  C23C18/1879 ,  C23C18/206 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/31 ,  C23C18/405 ,  C23C18/42 ,  C23C18/44 ,  H05K3/1275 ,  H05K3/182 ,  H05K2203/0143 ,  H05K2203/0534 ,  H05K2203/0709

摘要： A process comprising the step of : contact printing exclusive of stamp printing a pattern of an electroless deposition catalyst via a hydrophilic phase to a receiving medium, wherein said electroless deposition catalyst requires no activation prior to electroless deposition.

公开(公告)号：EP0917598A1

公开(公告)日：1999-05-26

申请号：EP98933437.0

申请日：1998-05-05

申请人： ROBERT BOSCH GMBH

发明人： WEBER, Lothar ,  BRINZ, Thomas

IPC分类号： C23C18

CPC分类号： C23C18/36 ,  C23C18/1879 ,  C23C18/206

摘要： The invention relates to a method for selective metallization, or selective activation of metal substrates structured with plastic or oxide ceramic compounds. Only the metal surface is metallized, i.e. electro-conductively, without coating the structuring materials. The metal surface is metallized and activated in a single step.

公开(公告)号：EP0625590B1

公开(公告)日：1996-09-04

申请号：EP94303400.9

申请日：1994-05-11

申请人： GENERAL ELECTRIC COMPANY

发明人： Chao, Herbert Shin-I ,  Fasoldt, Carol Lynn

IPC分类号： C23C18/20 ,  C23C18/22 ,  C23C18/24 ,  C23C18/28

CPC分类号： C23C18/206 ,  H05K3/181 ,  H05K3/381 ,  Y10S205/917 ,  Y10S205/928 ,  Y10T428/12569