Dual wafer load lock
    1.
    发明公开
    Dual wafer load lock 审中-公开
    Duale Wafer Ladungsschleuse

    公开(公告)号:EP1278230A2

    公开(公告)日:2003-01-22

    申请号:EP02254961.2

    申请日:2002-07-15

    IPC分类号: H01L21/00

    摘要: The disclosure relates to method and apparatus for transferring a substrate between a first environment having a first pressure and a second environment having a vacuum pressure is provided. In one embodiment, the apparatus comprises a chamber body (202) having a first port (238) disposed in a first wall (208) and a second port (239) disposed in a second wall that seals the chamber from the first and second environments. A cooling plate (280), a first substrate holder (204) and a second substrate holder (206) are disposed within the chamber body. The cooling plate is disposed at the bottom (216) of the chamber body. The first port and the second port are sequentially opened and the pressure within the load lock regulated to allow substrate to pass through the load lock. A window (250) is disposed in the top of the chamber body that allows a metrology device (428) to view the chamber volume.

    摘要翻译: 本公开涉及用于在具有第一压力的第一环境和具有真空压力的第二环境之间转移衬底的方法和装置。 在一个实施例中,该装置包括具有设置在第一壁(208)中的第一端口(238)和设置在第二壁中的第二端口(239)的室主体(202),该第二端口将腔室与第一和第二环境密封 。 冷却板(280),第一基板保持架(204)和第二基板支架(206)设置在室主体内。 冷却板设置在室主体的底部(216)处。 顺序地打开第一端口和第二端口,并且调节负载锁中的压力以允许衬底通过负载锁。 窗口(250)设置在室主体的顶部,允许计量装置(428)观察室体积。

    Dual wafer load lock
    2.
    发明公开
    Dual wafer load lock 审中-公开
    双晶片负载锁定

    公开(公告)号:EP1278230A3

    公开(公告)日:2004-02-18

    申请号:EP02254961.2

    申请日:2002-07-15

    IPC分类号: H01L21/00

    摘要: The disclosure relates to method and apparatus for transferring a substrate between a first environment having a first pressure and a second environment having a vacuum pressure is provided. In one embodiment, the apparatus comprises a chamber body (202) having a first port (238) disposed in a first wall (208) and a second port (239) disposed in a second wall that seals the chamber from the first and second environments. A cooling plate (280), a first substrate holder (204) and a second substrate holder (206) are disposed within the chamber body. The cooling plate is disposed at the bottom (216) of the chamber body. The first port and the second port are sequentially opened and the pressure within the load lock regulated to allow substrate to pass through the load lock. A window (250) is disposed in the top of the chamber body that allows a metrology device (428) to view the chamber volume.