公开(公告)号：EP1384263B1

公开(公告)日：2005-03-30

申请号：EP02735294.7

申请日：2002-04-23

申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. ,  Possehl Electronics Deutschland GmbH

发明人： LÜTHJE, Holger ,  KLAGES, Claus-Peter ,  VAN DER ZANDEN, Johannes Theodorus Maria ,  THIELE, Arno

IPC分类号： H01L23/495

CPC分类号： H01L23/49582 ,  H01L21/4835 ,  H01L2924/0002 ,  H05K3/24 ,  H01L2924/00

摘要： The invention relates to a support for electrical circuit elements that, for electrically connecting circuit elements by soldering, bonding or gluing, is comprised of a structured base body or is coated with structures consisting of easily oxidizing metals that have a multilayer, electrically conductive covering, which is inert on the outer surface, prevents a migration of the easily oxidizing metals, and has good soldering, bonding or adhering properties. The covering has the following composition: a) a first single ply or multiply layer that serves as an adhesive/barrier layer; b) a second single ply or multiply layer that serves as a functional layer for soldering, bonding or gluing, and; c) a third single ply or multiply layer, which is placed on the outer surface of the covering and which has inert properties and a high surface energy.

公开(公告)号：EP1384263A2

公开(公告)日：2004-01-28

申请号：EP02735294.7

申请日：2002-04-23

申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DERANGEWANDTEN FORSCHUNG E.V. ,  Possehl Electronics Deutschland GmbH

发明人： LÜTHJE, Holger ,  KLAGES, Claus-Peter ,  VAN DER Zanden, Johannes Theodorus Maria ,  THIELE, Arno

IPC分类号： H01L23/495

CPC分类号： H01L23/49582 ,  H01L21/4835 ,  H01L2924/0002 ,  H05K3/24 ,  H01L2924/00

摘要： The invention relates to a support for electrical circuit elements that, for electrically connecting circuit elements by soldering, bonding or gluing, is comprised of a structured base body or is coated with structures consisting of easily oxidizing metals that have a multilayer, electrically conductive covering, which is inert on the outer surface, prevents a migration of the easily oxidizing metals, and has good soldering, bonding or adhering properties. The covering has the following composition: a) a first single ply or multiply layer that serves as an adhesive/barrier layer; b) a second single ply or multiply layer that serves as a functional layer for soldering, bonding or gluing, and; c) a third single ply or multiply layer, which is placed on the outer surface of the covering and which has inert properties and a high surface energy.