THIN-FILM PHOTOVOLTAIC DEVICE WITH WAVY MONOLITHIC INTERCONNECTS
    1.
    发明公开
    THIN-FILM PHOTOVOLTAIC DEVICE WITH WAVY MONOLITHIC INTERCONNECTS 审中-公开
    DENNNSCHICHT-FOTOVOLTAIKMODUL MIT GEWELLTEN MONOLITHISCHEN VERBINDUNGEN

    公开(公告)号:EP2834847A2

    公开(公告)日:2015-02-11

    申请号:EP13722090.1

    申请日:2013-03-27

    申请人: Flisom AG

    摘要: A thin-film optoelectronic module device (100) and design method comprising at least three monolithically-interconnected cells (104, 106, 108) where at least one monolithically-interconnecting line (250) depicts a spatial periodic or quasi-periodic wave and wherein the optoelectronic surface of said thin-film optoelectronic module device (100) presents at least one set of at least three zones (210, 220, 230) having curves of substantially parallel monolithic interconnect lines. Border zones (210, 230) have a lower front-contact sheet resistance than that of internal zone (220). Said curves of substantially parallel interconnecting lines may comprise peaks of triangular or rounded shape, additional spatial periods that are smaller than a baseline period, and mappings from one curve to the adjacent curve such as in the case of non-rectangular module devices (100). The device (100) and design method are advantageous to reduce costs and materials to manufacture thin-film optoelectronic module devices (100) while increasing production yield, reliability, aesthetic appearance, and range of applications.

    摘要翻译: 一种薄膜光电子模块器件(100)和包括至少三个单片互连的单元(104,106,108)的设计方法,其中至少一个单片互连线(250)描绘空间周期性或准周期波,并且其中 所述薄膜光电子模块装置(100)的光电子表面呈现具有基本上平行的单片互连线的曲线的至少一组至少三个区域(210,220,230)。 边界区域(210,230)的前接触片电阻率低于内部区域(220)的电阻率。 基本上平行的互连线的所述曲线可以包括三角形或圆形形状的峰值,小于基线周期的附加空间周期以及从一个曲线到相邻曲线的映射,例如在非矩形模块装置(100)的情况下, 。 设备(100)和设计方法有利于降低制造薄膜光电子模块设备(100)的成本和材料,同时提高产量,可靠性,美学外观和应用范围。

    EVAPORATION CRUCIBLE WITH FLOATER
    3.
    发明公开
    EVAPORATION CRUCIBLE WITH FLOATER 审中-公开
    蒸发坩埚漂浮

    公开(公告)号:EP3314034A1

    公开(公告)日:2018-05-02

    申请号:EP16747614.2

    申请日:2016-06-28

    发明人: PFEIFFER, Reto

    IPC分类号: C23C14/24

    CPC分类号: C23C14/243

    摘要: Embodiments of the disclosure provided herein generally include an apparatus and method of depositing a layer on a substrate in a processing system by use of a physical vapor deposition technique. Embodiments of the disclosure provided herein also relate to linear evaporation sources used for vapor deposition of material onto substrates and more particularly for controlled material coating of large substrates, such as vacuum deposition on roll-to-roll substrates. The apparatus and methods disclosed herein include the use of a material flux controlled evaporation source (120) that is disposed within the processing region of a processing system. The material flux controlled evaporation source generally includes a material flux regulation device (float 180) that is configured to control a flux of an evaporated material from the evaporation source and improve the temperature uniformity within the evaporation source.