摘要:
Embodiments of the disclosure provided herein generally include an apparatus and method of depositing a layer on a substrate in a processing system by use of a physical vapor deposition technique. Embodiments of the disclosure provided herein also relate to linear evaporation sources used for vapor deposition of material onto substrates and more particularly for controlled material coating of large substrates, such as vacuum deposition on roll-to-roll substrates. The apparatus and methods disclosed herein include the use of a material flux controlled evaporation source (120) that is disposed within the processing region of a processing system. The material flux controlled evaporation source generally includes a material flux regulation device (float 180) that is configured to control a flux of an evaporated material from the evaporation source and improve the temperature uniformity within the evaporation source.
摘要:
A thin-film optoelectronic module device (100) and design method comprising at least three monolithically-interconnected cells (104, 106, 108) where at least one monolithically-interconnecting line (250) depicts a spatial periodic or quasi-periodic wave and wherein the optoelectronic surface of said thin-film optoelectronic module device (100) presents at least one set of at least three zones (210, 220, 230) having curves of substantially parallel monolithic interconnect lines. Border zones (210, 230) have a lower front-contact sheet resistance than that of internal zone (220). Said curves of substantially parallel interconnecting lines may comprise peaks of triangular or rounded shape, additional spatial periods that are smaller than a baseline period, and mappings from one curve to the adjacent curve such as in the case of non-rectangular module devices (100). The device (100) and design method are advantageous to reduce costs and materials to manufacture thin-film optoelectronic module devices (100) while increasing production yield, reliability, aesthetic appearance, and range of applications.