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    Radiation imaging device
    1.
    发明公开
    Radiation imaging device 有权
    放射线成像设备

    公开(公告)号：EP2103958A3

    公开(公告)日：2013-10-09

    申请号：EP09007290.1

    申请日：2005-05-10

    申请人： HAMAMATSU PHOTONICS K.K.

    发明人： Mori, Harumichi ,  Honda, Masahiko ,  Kyushima, Ryuji ,  Fujita, Kazuki

    IPC分类号： G01T1/20

    CPC分类号： H01L27/14618 ,  G01T1/2018 ,  H01L31/0203 ,  H01L31/02322 ,  H01L2924/0002 ,  H04N5/32 ,  H01L2924/00

    摘要： Wiring substrates 11 and 12 are positioned on a fixed base 10 in a manner such that there is a step between the wiring substrates, and radiation imaging elements 2 and 3, respectively having scintillators 25 and 35 deposited on photosensitive portions 21 and 31, are respectively mounted on the wiring substrates 11 and 12. The radiation imaging element 2 is positioned so that its setting surface protrudes beyond a radiation incident surface of the radiation imaging element 3, and the photosensitive portion 21 of the radiation imaging element 2 and the photosensitive portion 31 of the radiation imaging element 3 are juxtaposed to a degree to which the portions do not overlap. The photosensitive portion 21 of the radiation imaging element 2 extends close to an edge at the radiation imaging element 3 side and the scintillator 25 of substantially uniform thickness is formed up to this position.

    Solid-state image pickup device
    3.
    发明公开
    Solid-state image pickup device 有权
    固体摄像装置

    公开(公告)号：EP2727532A1

    公开(公告)日：2014-05-07

    申请号：EP14153021.2

    申请日：2009-06-11

    申请人： HAMAMATSU PHOTONICS K.K.

    发明人： Mori, Harumichi ,  Kyushima, Ryuji ,  Fujita, Kazuki

    IPC分类号： A61B6/00 ,  A61B6/14 ,  G01T1/20 ,  H01L27/14 ,  H01L31/09 ,  H04N5/321 ,  H04N5/378

    CPC分类号： H04N5/3694 ,  A61B6/06 ,  A61B6/14 ,  A61B6/4233 ,  G01T1/2018 ,  H01L27/14663 ,  H04N5/32 ,  H04N5/3743 ,  H04N5/378

    摘要： A solid-state image pickup device 1 includes a semiconductor substrate 3A having a pixel array 10A with pixels arrayed in M rows and NA columns, a semiconductor substrate 3B having a pixel array 10B with pixels arrayed in M rows and NB columns, and a first column of which is arranged along an NA-th column of the pixel array 10A, and a signal output section 20. The signal output section 20 outputs digital values corresponding to the respective columns from the first column to the n-th column (2≤n

    摘要翻译： 固态图像拾取装置1包括：半导体衬底3A，具有像素阵列10A，像素排列成M行和NA列;半导体衬底3B，具有像素排列10B，像素排列成M行和NB列;第一 其列被布置在像素阵列10A的第NA列中;以及信号输出部分20.信号输出部分20输出对应于从第一列到第n列（2≤ 像素阵列10A的n（n

    RADIATION IMAGING DEVICE
    4.
    发明公开
    RADIATION IMAGING DEVICE 审中-公开

    公开(公告)号：EP4215950A1

    公开(公告)日：2023-07-26

    申请号：EP23161741.6

    申请日：2019-10-09

    申请人： Hamamatsu Photonics K.K.

    发明人： Kyushima, Ryuji ,  Fujita, Kazuki ,  Sawada, Junichi ,  Aritake, Takao ,  Ichikawa, Minoru ,  Okada, Haruyoshi ,  Fukamizu, Seiji ,  Namba, Shuhei

    IPC分类号： G01T1/20 ,  H01L27/144 ,  H01L27/146

    摘要： A radiation imaging device according to one embodiment comprises a radiation detection panel, a base substrate having a support surface configured to support the radiation detection panel, and a housing configured to accommodates the radiation detection panel and the base substrate, wherein: the housing has a top wall and a bottom wall, the base substrate has a protruding portion which protrudes further outward than the radiation detection panel when seen in a direction orthogonal to the support surface, a first extending portion is provided to the support surface of the protruding portion, a second extending portion is provided to a back surface of the protruding portion, the second extending portion being disposed at a position which it faces the first extending portion with the protruding portion interposed therebetween, and the base substrate is supported on the top wall via the first extending portion and is supported on the bottom wall via the second extending portion.

    Radiation imaging device
    6.
    发明公开
    Radiation imaging device 有权
    Strahlungsbildgebungsvorrichtung

    公开(公告)号：EP2103958A2

    公开(公告)日：2009-09-23

    申请号：EP09007290.1

    申请日：2005-05-10

    申请人： HAMAMATSU PHOTONICS K.K.

    发明人： Mori, Harumichi ,  Honda, Masahiko ,  Kyushima, Ryuji ,  Fujita, Kazuki

    IPC分类号： G01T1/20

    CPC分类号： H01L27/14618 ,  G01T1/2018 ,  H01L31/0203 ,  H01L31/02322 ,  H01L2924/0002 ,  H04N5/32 ,  H01L2924/00

    摘要： Wiring substrates 11 and 12 are positioned on a fixed base 10 in a manner such that there is a step between the wiring substrates, and radiation imaging elements 2 and 3, respectively having scintillators 25 and 35 deposited on photosensitive portions 21 and 31, are respectively mounted on the wiring substrates 11 and 12. The radiation imaging element 2 is positioned so that its setting surface protrudes beyond a radiation incident surface of the radiation imaging element 3, and the photosensitive portion 21 of the radiation imaging element 2 and the photosensitive portion 31 of the radiation imaging element 3 are juxtaposed to a degree to which the portions do not overlap. The photosensitive portion 21 of the radiation imaging element 2 extends close to an edge at the radiation imaging element 3 side and the scintillator 25 of substantially uniform thickness is formed up to this position.

    摘要翻译： 接线基板11,12以这样的方式被定位在固定基座10上，使得在布线基板之间分别具有分别具有沉积在感光部分21和31上的闪烁体25和35的辐射成像元件2和3 安装在布线基板11和12上。放射线成像元件2被定位成使得其设置表面突出超过辐射成像元件3的辐射入射表面，并且辐射成像元件2的感光部分21和感光部分31 辐射成像元件3的一部分并置于该部分不重叠的程度。 辐射摄像元件2的感光部分21靠近辐射摄像元件3侧的边缘延伸，并且形成基本上均匀厚度的闪烁器25直到该位置。