摘要:
In each of corresponding image sensor chips arranged in a line and cascaded with each other to form an image sensor, a dummy photocell (16) which is configured similarly to the photocells (1-1 to 1-N) is provided, having its window is shielded from light. A dummy select switch (17) which selectively makes connection of the dummy photocell (16) with a signal line (3) on which the image signals from the photocells (1-1 to 1-N) are output. The dummy select switch (17) is kept closed upon completion of the drive period of the photocells. This occurs only at the last image sensor chip in the image sensor, so that the output of the dummy photocell (16) is used as a reference for the dark output during the blanking period. In another aspect of the invention, a switch (33) is provided within the chip to shunt the image signal output terminal (11) and the ground responsive to the clock pulse thereby to remove the remaining electric charge from the capacitor (28) provided outside the chips to integrate the output of the image sensor.
摘要:
A photoelectric conversion device (10) includes a plurality of light receiving elements (120), a plurality of A/D conversion units (140), and an offset giving unit (15). The light receiving elements (120) are arrayed in one direction and each convert a light signal into an electrical signal. The A/D conversion units (140) perform A/D conversion on the electrical signals output from the light receiving elements (120). The offset giving unit (15) gives an offset voltage of a certain level to the electrical signals output from the light receiving elements (120) without flowing a steady current before the electrical signals are input into the A/D conversion units (140).
摘要:
A module for high speed image processing includes an image sensor for generating a plurality of analog outputs representing an image and a plurality of high density digitizers (HDDs) for concurrently processing the plurality of analog outputs. Each HDD is an integrated circuit configured to process in parallel a predetermined set of the analog outputs. Each channel of the HDD can include an analog front end (AFE) for conditioning a signal representing one sensor analog output, an analog-to-digital converter (ADC) for converting a conditioned signal into a digital signal, and a data formatting block for calibrations and formatting the digital signal for transport to an off-chip device. The HDDs and drive electronics are combined with the image sensor into one package to optimize signal integrity and high dynamic range, and to achieve high data rates through use of synchronized HDD channels. Combining multiple modules results in a highly scalable imaging subsystem optimized for inspection and metrology applications.
摘要:
An apparatus for changing the changeover pixels during an actual scan of an input medium including means for scanning across a two-dimensional surface during a non-actual scan, wherein the means for scanning includes at least two optically butt image sensors. The apparatus also includes means, operative during the non-actual scan, for determining the changing locations of changeover pixels of the image sensors, the changing locations caused at least by non-uniformities in the two-dimensional surface and correction means, operative during the actual scan, for redefining the changeover pixels in accordance with the output of the means for determining.
摘要:
An apparatus for changing the changeover pixels during an actual scan of an input medium including means for scanning across a two-dimensional surface during a non-actual scan, wherein the means for scanning includes at least two optically butt image sensors. The apparatus also includes means, operative during the non-actual scan, for determining the changing locations of changeover pixels of the image sensors, the changing locations caused at least by non-uniformities in the two-dimensional surface and correction means, operative during the actual scan, for redefining the changeover pixels in accordance with the output of the means for determining.
摘要:
A reading out circuit for a series of linear image sensors (11-15) having end light elements masked (11M-15M) and being arranged in a staggered line. The data is written in parallel into a series of multilocation storage elements (51-55 or 61-65), beginning with the masked light element being stored in a central location. The storing is then wrapped around so that the masked value is overwritten.
摘要:
A solid-state image pickup device 1 includes a semiconductor substrate 3A having a pixel array 10A with pixels arrayed in M rows and NA columns, a semiconductor substrate 3B having a pixel array 10B with pixels arrayed in M rows and NB columns, and a first column of which is arranged along an NA-th column of the pixel array 10A, and a signal output section 20. The signal output section 20 outputs digital values corresponding to the respective columns from the first column to the n-th column (2≤n