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8 条记录 (耗时 0.013 秒)

    Tin-lead alloy plating bath
    1.
    发明公开
    Tin-lead alloy plating bath 失效
    Badfürdas Plattieren einer Zink-Blei-Legierung。

    公开(公告)号：EP0172267A1

    公开(公告)日：1986-02-26

    申请号：EP84109981.5

    申请日：1984-08-22

    申请人： Hyogo Prefecture ,  Daiwa Fine Chemicals Co., Ltd. ,  Ishihara Chemical Co., Ltd.

    发明人： Obata, Keigo ,  Dohi, Nobuyasu ,  Okuhama, Yoshiaki ,  Masaki, Seishi ,  Okada, Yukiyoshi ,  Yoshida, Tadashi

    IPC分类号： C25D3/60

    CPC分类号： C25D3/60 ,  H05K3/3473

    摘要： A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is characterized by the addition of a guanamine compound having the general formula

    wherein R, and R 2 , which may be the same or different, present each a hydrogen atom, C 1-18 straight- or branched-chain alkyl radical, C 1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C 3-7 cycloalkyl radical, or R 1 and R 2 may combine to form a carbon cycle or hetero cycle, and A represents a lower alkylene radical.

    摘要翻译： 基于包含烷烃磺酸或链烷醇磺酸的二次锡和铅盐的主镀液的锡铅合金电镀槽的特征在于加入通式为CHEM的胍胺化合物，其中R 1和R 2可以 相同或不同，各自表示氢原子，C1-18直链或支链烷基，C1-18直链或支链烷氧基 - 低级烷基或C3-7环烷基，或R1和 R2可以结合形成碳循环或杂环，A代表低级亚烷基。

    Baths or organic sulfonate solution for bismuth and bismuth alloy plating
    4.
    发明公开
    Baths or organic sulfonate solution for bismuth and bismuth alloy plating 失效
    基于用于铋和铋合金的电镀的有机磺酸盐溶液的含浴场。

    公开(公告)号：EP0255558A1

    公开(公告)日：1988-02-10

    申请号：EP86113044.1

    申请日：1986-09-22

    申请人： Daiwa Fine Chemicals Co., Ltd. ,  Ishihara Chemical Co., Ltd.

    发明人： Masaki, Seishi ,  Tsuji, Kiyotaka ,  Okuhama, Yoshiaki ,  Akutsu, Toshiji

    IPC分类号： C25D3/54 ,  C25D3/56

    CPC分类号： C25D3/56 ,  C25D3/54

    摘要： A bismuth or bismuth alloy plating bath comprises as essential ingredients an organic sulfonic acid of the general formula (I)
    wherein R is a C 1 - 5 alkyl radical, X 1 is a halogen atom or hydroxyl, aryl, alkylaryl, carboxyl, or sulfonyl radical which may be in any optional position of the alkyl radical, and n is an integer of 0 to 3, or of the formula (II)
    wherein X 2 is a halogen atom or hydroxyl, alkyl, aryl, alkylaryl, aldehyde, carboxyl, nitro, mercapto, sulfonyl, or amino radical, or two X 2 ' S which may combine with a benzene ring to form a naphthalene ring, and m is an integer of 0 to 3, and a bismuth salt of the acid or a mixture of the bismuth salt of the acid and one or more other metal salts of the acid.

    摘要翻译： 甲铋或铋合金电镀浴包含芳基的通式（I）（X1）的有机磺酸的作为必要成分正SO3H（I）worin R为C 1-5烷基，X 1是卤素原子或羟基， ，烷基芳基，羧基，或磺酰基，其可以是在烷基中的任何任选的位置，n为0〜3的整数，或式（II）的 worin X2是卤原子或羟基，烷基 基，芳基，烷基芳基，醛基，羧基，硝基，巯基，磺酰基，或氨基基团，或两个X 2的可以与苯环结合形成萘环，而m是0至3的整数，和铋盐 该酸或该酸和该酸的一种或多种其它金属的盐的铋盐的混合物。

    Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use
    7.
    发明公开
    Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use 失效
    用于生产铅磺酸盐和具有锡磺酸盐使用用于焊接涂层电解过程

    公开(公告)号：EP0770708A1

    公开(公告)日：1997-05-02

    申请号：EP95115894.8

    申请日：1995-10-09

    申请人： Daiwa Fine Chemicals Co., Ltd.

    发明人： Okuhama, Yoshiaki ,  Masaki, Seishi ,  Takeuchi, Takao 2-810, Jamesyama Greencopo ,  Matsuda, Yoshihara ,  Yoshimoto, Masakazu

    IPC分类号： C25B3/00 ,  B01D61/44

    CPC分类号： C25B3/00 ,  C25D3/60

    摘要： An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode (2) and a plurality of cathodes (4) in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes (5,6) into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive α particle counts of less than 0.1 CPH/cm 2 .

    摘要翻译： 的制造铅和锡磺酸盐，其包括施加直流电压到阳极处（2）和电解池的阴极（4）的多个部分并加以从而溶解铅或锡，在电解液中的电解过程。 的电解池是由阳离子和阴离子交换膜（5,6）转换成阳极室和阴极室隔开。 电解液是一种有机磺酸的溶液中，并将阳极是铅或锡。 该过程减少放射性同位素的内容：使用雅舞蹈的铅和锡的盐，与小于0.1 CPH的发明展放射性α粒子计数通过焊料镀敷形成，例如铀和钍到小于50ppb的水平，因此，涂层/ 厘米<2>。