公开(公告)号：EP4020124A1

公开(公告)日：2022-06-29

申请号：EP21198063.6

申请日：2021-09-21

申请人： Intel Corporation

发明人： MAGI, Aleksander ,  KU, Jeff ,  PAAVOLA, Juha ,  RAJU, Prakash Kurma

IPC分类号： G06F1/20 ,  G06F1/16 ,  H04M1/18 ,  F16F15/08

摘要： Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component (208) positioned inside the housing. A thermally conductive shock absorber (224) is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber includes an impact absorbing material (230) and a thermal conductive material (232) being in contact with at least a portion of the impact absorbing material.

公开(公告)号：EP4002057A1

公开(公告)日：2022-05-25

申请号：EP21197807.7

申请日：2021-09-20

申请人： INTEL Corporation

发明人： RAJU, Prakash Kurma ,  ALVA, Samarth ,  ANBALAGAN, Bhavaneeswaran ,  BABU, Triplicane Gopikrishnan ,  PICHUMANI, Prasanna ,  DODDI, Raghavendra ,  SUDHAKAR, Sudheera ,  BAWA, Ritu

IPC分类号： G06F1/16 ,  G06F1/20

摘要： An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

公开(公告)号：EP4156880A1

公开(公告)日：2023-03-29

申请号：EP22188957.9

申请日：2022-08-05

申请人： INTEL Corporation

发明人： SUBRAMANYA, Bala P. ,  RAJU, Prakash Kurma ,  SINGH, Navneet K. ,  BEDARE, Sachin ,  R, Vijith Halestoph

IPC分类号： H05K9/00

摘要： An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.

公开(公告)号：EP3974758A1

公开(公告)日：2022-03-30

申请号：EP21193107.6

申请日：2021-08-25

申请人： INTEL Corporation

发明人： SHAIKH, Javed ,  RAJU, Prakash Kurma ,  DHANDAPANI, Kathiravan

IPC分类号： F28D15/00

摘要： In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus.

公开(公告)号：EP3865978A1

公开(公告)日：2021-08-18

申请号：EP20197338.5

申请日：2020-09-22

申请人： INTEL Corporation

发明人： SINGH, Bijendra ,  RAJU, Prakash Kurma ,  ALVA, Samarth

IPC分类号： G06F1/20 ,  G06F1/16

摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, where the second housing includes a fan, an inlet, and actuators, and a hinge, where the hinge rotatably couples the first housing to the second housing. When the first housing is rotated over the inlet, the actuators lower the inlet to create a gap between the inlet and the first housing. In some examples, the inlet includes slats and when the first housing is rotated over the inlet, a distance between each of the slats increases from a first distance to a second distance.

公开(公告)号：EP4303692A1

公开(公告)日：2024-01-10

申请号：EP23176182.6

申请日：2023-05-30

申请人： INTEL Corporation

发明人： SUNG, Gavin ,  HANCHATE, Mallari C. ,  PICHUMANI, Prasanna ,  RAJU, Prakash Kurma ,  LIU, Chun-Ting

IPC分类号： G06F1/16 ,  G06F1/3206 ,  G06F1/3234

摘要： A cover for a tablet or similar computer device equipped with strap hinges is disclosed. In embodiments, the cover may include three strap hinges to allow the tablet to be placed in several different configurations. The cover is equipped with at least two magnets in different polarities, which may be detected by the tablet. Based on the detection of at least one magnet and its polarity, the tablet may cause the interface of its operating system to be placed into a configuration appropriate to the configuration of the cover. Other embodiments may be described and/or claimed.

公开(公告)号：EP4020123A1

公开(公告)日：2022-06-29

申请号：EP21196795.5

申请日：2021-09-15

申请人： INTEL Corporation

发明人： BOYINA, Penchala Pratap Binni ,  D, Kathiravan ,  GOPIKRISHNAN, Babu Triplicane ,  RAJU, Prakash Kurma ,  SEKAR, Deepak ,  THAKUR, Hari Shanker

IPC分类号： G06F1/20 ,  H05K7/20 ,  H01L23/427 ,  F28D15/02

摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a substrate (116), one or more heat sources (110) over the substrate, one or more heat pipes (118a) thermally coupled to the one or more heat sources, a heat spreader (120a) coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms (122a) coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.