公开(公告)号：EP4020124A1

公开(公告)日：2022-06-29

申请号：EP21198063.6

申请日：2021-09-21

申请人： Intel Corporation

发明人： MAGI, Aleksander ,  KU, Jeff ,  PAAVOLA, Juha ,  RAJU, Prakash Kurma

IPC分类号： G06F1/20 ,  G06F1/16 ,  H04M1/18 ,  F16F15/08

摘要： Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component (208) positioned inside the housing. A thermally conductive shock absorber (224) is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber includes an impact absorbing material (230) and a thermal conductive material (232) being in contact with at least a portion of the impact absorbing material.

公开(公告)号：EP4009141A3

公开(公告)日：2022-07-06

申请号：EP21198568.4

申请日：2021-09-23

申请人： INTEL Corporation

发明人： KULKARNI, Shantanu D. ,  KU, Jeff ,  CHERUKKATE, Sumod ,  ZHAI, Tongyan ,  POTLURI, Srikanth ,  MASLOV, Jordan E.

IPC分类号： G06F1/20 ,  H04R1/32 ,  G10K11/175

摘要： Systems, apparatus, articles of manufacture, methods are disclosed to reshape fan noise of a fan of an electronic device. An example system includes a microphone to detect a first acoustic signal including fan noise. The example system also includes a processor to: identify a tone in the first acoustic signal; and determine a gain to add to the first acoustic signal to mask the tone. In addition, the example system includes a sound transducer to present a second acoustic signal including the gain.

公开(公告)号：EP4454009A1

公开(公告)日：2024-10-30

申请号：EP21968594.8

申请日：2021-12-23

申请人： INTEL Corporation

发明人： PRATHABAN, Satish ,  PARTHASARATHY, Ramaswamy ,  PATRA, Biswajit ,  ZHAI, Tongyan ,  KU, Jeff ,  LIM, Min Suet ,  HUANG, Yi ,  XIAO, Kai ,  YOUNG, Gene F. ,  SHI, Weimin

IPC分类号： H01L23/02

公开(公告)号：EP4082308A1

公开(公告)日：2022-11-02

申请号：EP20904932.9

申请日：2020-12-23

申请人： INTEL Corporation

发明人： BAWA, Ritu ,  CARDENAS, Ruander ,  D, Kathiravan ,  GO, Jia Yan ,  GOH, Chin Kung ,  KU, Jeff ,  KURMA RAJU, Prakash ,  LIU, Baomin ,  LOO, Twan Sing ,  MAKINEN, Mikko Antero ,  MISHRA, Columbia ,  PAAVOLA, Juha Tapani ,  PICHUMANI, Prasanna ,  RAGLAND, Daniel ,  RAJA, Kannan ,  SEE, Khai Ern ,  SHAIKH, Javed ,  SUBRAMANIAM, Gokul ,  SUN, George Baoci ,  TIAN, Xiyong ,  YANG, Hua ,  CARBONE, Mark ,  PARANJAPE, Vivek ,  PINJARI, Nehakausar ,  THAKUR, Hari Shanker ,  MOORE, Christopher M. ,  FRICKE, Gustavo ,  HUTTULA, Justin M. ,  SUNG, Gavin ,  LIU, Sammi WY ,  SEN, Arnab ,  LIU, Tim ,  JIANG, Jason Y. ,  JUAN, Gerry ,  NIEN, Cora ,  LIN, Lance ,  KUKLINSKI, Evan Piotr

IPC分类号： H05K7/20 ,  F28D15/04

公开(公告)号：EP3835919A1

公开(公告)日：2021-06-16

申请号：EP20194492.3

申请日：2020-09-04

申请人： INTEL Corporation

发明人： KULKARNI, Shantanu D. ,  KU, Jeff ,  OKULEY, James

IPC分类号： G06F1/16

摘要： Apparatus, devices, systems, methods, and articles of manufacture are disclosed for physical keyboards with multi-display computing devices. An example computing device includes a support plate, a first display hingedly coupled to the support plate, and a physical keyboard hingedly coupled to the support plate.

公开(公告)号：EP4028853A1

公开(公告)日：2022-07-20

申请号：EP19945000.8

申请日：2019-09-10

申请人： INTEL Corporation

发明人： HUNG, Vincent ,  KU, Jeff ,  WANG, Andy B. ,  KONG, Duck Young ,  BAI, Chunlin

IPC分类号： G06F1/16

公开(公告)号：EP4009141A2

公开(公告)日：2022-06-08

申请号：EP21198568.4

申请日：2021-09-23

申请人： INTEL Corporation

发明人： KULKARNI, Shantanu D. ,  KU, Jeff ,  CHERUKKATE, Sumod ,  ZHAI, Tongyan ,  POTLURI, Srikanth ,  MASLOV, Jordan E.

IPC分类号： G06F1/20 ,  H04R1/32 ,  G10K11/175

摘要： Systems, apparatus, articles of manufacture, methods are disclosed to reshape fan noise of a fan of an electronic device. An example system includes a microphone to detect a first acoustic signal including fan noise. The example system also includes a processor to: identify a tone in the first acoustic signal; and determine a gain to add to the first acoustic signal to mask the tone. In addition, the example system includes a sound transducer to present a second acoustic signal including the gain.

公开(公告)号：EP3314355A1

公开(公告)日：2018-05-02

申请号：EP16818414.1

申请日：2016-05-27

申请人： INTEL Corporation

发明人： SUNG, Pei-yang ,  KU, Jeff ,  LEE, Ming-Che ,  TSAI, Simon

IPC分类号： G06F1/16

CPC分类号： G06F1/1681 ,  E05F1/1215 ,  E05Y2900/606 ,  G06F1/1626

摘要： Particular embodiments described herein provide for device that includes a first housing, a cradle, and a hinge that rotatable couples the first housing to the cradle. The hinge includes a switch bolt configured to selectively provide friction torque to the hinge, a torsion spring configured to provide spring torque to the hinge, and a switch mechanism to activate and deactivate the switch bolt, wherein the friction torque provided by the switch bolt is greater than the spring torque provided by the torsion spring.