摘要:
A polynuclear polyhydric phenol of the general formula (I); wherein R 1 and R 2 each represent a hydrogen atom or a C 1 -C 4 alkyl group, R 3 represents a hydrogen atom, an alkyl group, an aryl group or a halogen atom, and n is an integer of from 0 to 10, can be used to provide a polyepoxy compound which is a polyglycidyl ether of the polynuclear polyhydric ether. When the polyepoxy compound is combined with a curing agent, a curable epoxy resin composition results which can be used to provide molded cured articles having excellent heat resistance characteristics.
摘要:
Conventional novolak phenolic resins generally possess molecular weights of 1200 or less and exhibit unsatisfactory heat resistance and mechanical properties for all intended uses. Attempts to produce higher-molecular-weight resins have failed. These difficulties have been overcome and a high-molecular-weight novolak substituted phenolic resin having a number average molecular weight of at least 1500 is prepared by reacting (A) (i) a phenol component mainly comprising a bifunctional phenol or (ii) a low-molecular-weight novolak substituted phenolic resin derived from this phenol and an aldehyde, with (B) a chain extender selected from (i) dimethylolated products of bifunctional or trifunctional phenols, (ii) a low-molecular-weight resol substituted phenolic resin derived from a phenol component mainly comprising a bifunctional phenol and an aldehyde, (iii), an aldehyde, (iv) a ketone, (v) a diol and (vi) a dihalide in the presence of an acid catalyst, with the proviso that if the reactant (A) is the phenol component (i), the chain extender (B), is the resol substituted phenolic resin (ii). These high-molecular-weight novolak resins can be used in setting resin compositions with setting resins such as epoxy resins.
摘要:
Resin compositions containing a setting resin and a low-molecular-weight novolak resin do not possess satisfactory heat resistance and mechanical strength characteristics for all intended uses. These difficulties can be overcome by employing a resin composition comprising (A) a setting resin and (B) 10 to 200 parts by weight, per 100 parts by weight of said resin (A), of a substantially linear, high-molecular-weight novolak substituted phenolic resin which is derived from a phenol component mainly comprising at least one bifunctional phenol and which has a number average molecular weight of at least 1500.
摘要:
Conventional novolak phenolic resins generally possess molecular weights of 1200 or less and exhibit unsatisfactory heat resistance and mechanical properties for all intended uses. Attempts to produce higher-molecular-weight resins have failed. These difficulties have been overcome and a high-molecular-weight novolak substituted phenolic resin having a number average molecular weight of at least 1500 is prepared by reacting (A) (i) a phenol component mainly comprising a bifunctional phenol or (ii) a low-molecular-weight novolak substituted phenolic resin derived from this phenol and an aldehyde, with (B) a chain extender selected from (i) dimethylolated products of bifunctional or trifunctional phenols, (ii) a low-molecular-weight resol substituted phenolic resin derived from a phenol component mainly comprising a bifunctional phenol and an aldehyde, (iii), an aldehyde, (iv) a ketone, (v) a diol and (vi) a dihalide in the presence of an acid catalyst, with the proviso that if the reactant (A) is the phenol component (i), the chain extender (B), is the resol substituted phenolic resin (ii). These high-molecular-weight novolak resins can be used in setting resin compositions with setting resins such as epoxy resins.
摘要:
Resin compositions containing a setting resin and a low-molecular-weight novolak resin do not possess satisfactory heat resistance and mechanical strength characteristics for all intended uses. These difficulties can be overcome by employing a resin composition comprising (A) a setting resin and (B) 10 to 200 parts by weight, per 100 parts by weight of said resin (A), of a substantially linear, high-molecular-weight novolak substituted phenolic resin which is derived from a phenol component mainly comprising at least one bifunctional phenol and which has a number average molecular weight of at least 1500.