摘要:
A method of purifying novolak resins useful as a material for coating on a semiconductor substrate, which comprises dissolving a novolak resin in a solvent having a solubility in water at 20°C of not more than l00, and extracting the resulting solution with an acidic aqueous solution thereby to reduce the metal content of the resin. If desired, the solution may be subjected to both the extraction step and a centrifugal separation step in a desired sequence instead of the extraction step alone.
摘要:
An epoxy resin composition comprising a polyglycidyl ether prepared by reacting a 3-methyl-6-alkylphenol in the presence or absence of a phenol other than the 3-methyl-6-alkylphenol with an aldehyde to obtain a novolak, and then reacting the novolak with an epihalohydrin, which composition is useful in electronic fields, for example, for encapsulating semiconductor products or for the production of printed circuit boards.
摘要:
Conventional novolak phenolic resins generally possess molecular weights of 1200 or less and exhibit unsatisfactory heat resistance and mechanical properties for all intended uses. Attempts to produce higher-molecular-weight resins have failed. These difficulties have been overcome and a high-molecular-weight novolak substituted phenolic resin having a number average molecular weight of at least 1500 is prepared by reacting (A) (i) a phenol component mainly comprising a bifunctional phenol or (ii) a low-molecular-weight novolak substituted phenolic resin derived from this phenol and an aldehyde, with (B) a chain extender selected from (i) dimethylolated products of bifunctional or trifunctional phenols, (ii) a low-molecular-weight resol substituted phenolic resin derived from a phenol component mainly comprising a bifunctional phenol and an aldehyde, (iii), an aldehyde, (iv) a ketone, (v) a diol and (vi) a dihalide in the presence of an acid catalyst, with the proviso that if the reactant (A) is the phenol component (i), the chain extender (B), is the resol substituted phenolic resin (ii). These high-molecular-weight novolak resins can be used in setting resin compositions with setting resins such as epoxy resins.