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公开(公告)号:EP0239216A2
公开(公告)日:1987-09-30
申请号:EP87301212.4
申请日:1987-02-12
IPC分类号: H01L27/08 , H01L29/72 , H01L21/285
CPC分类号: H01L29/66272 , H01L21/8249 , H01L27/0623 , H01L29/0804 , Y10S148/123 , Y10S148/124
摘要: A process for fabricating a CMOS compatible bipolar transistor is described. The transistor, which is of the polysilicon emitter type, is fabricated by forming a p-type layer in a well, providing a polysilicon emitter in contact with the layer, using the emitter as a mask to implant p⁺-type base contact regions, and applying contacts to the device.
摘要翻译: 描述了制造CMOS兼容双极晶体管的工艺。 通过在阱中形成p型层来制造晶体管,该晶体管提供与该层接触的多晶硅发射极,使用发射极作为掩模来注入p +型碱接触 区域,并将联系人应用于设备。
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公开(公告)号:EP0239216A3
公开(公告)日:1990-03-14
申请号:EP87301212.4
申请日:1987-02-12
IPC分类号: H01L27/08 , H01L29/72 , H01L21/285
CPC分类号: H01L29/66272 , H01L21/8249 , H01L27/0623 , H01L29/0804 , Y10S148/123 , Y10S148/124
摘要: A process for fabricating a CMOS compatible bipolar transistor is described. The transistor, which is of the polysilicon emitter type, is fabricated by forming a p-type layer in a well, providing a polysilicon emitter in contact with the layer, using the emitter as a mask to implant p⁺-type base contact regions, and applying contacts to the device.
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