公开(公告)号：EP0710177B1

公开(公告)日：2003-05-02

申请号：EP94922596.5

申请日：1994-07-20

申请人： OHMEGA ELECTRONICS, INC.

发明人： NGUYEN, Phong, X. ,  NISSEN, Steven, R.

IPC分类号： H05K1/16 ,  H05K3/06

CPC分类号： H05K1/167 ,  H05K3/062 ,  H05K3/064 ,  H05K3/067 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T428/12854 ,  Y10T428/24917

摘要： A circuit board material (10) is disclosed which includes a support layer (12), at least one electrical resistance layer (14) having a preselected resistivity adhered to the support layer (12), a barrier layer (16) adhered to the electrical resistance layer (14), and a conductive layer (18) adhered to the barrier layer (16). The barrier layer (16) is capable of protecting the resistance layer (14) from attack by alkaline ammoniacal copper etchants. A method of producing the circuit board material (10) is also disclosed.

公开(公告)号：EP0710177A1

公开(公告)日：1996-05-08

申请号：EP94922596.0

申请日：1994-07-20

申请人： OHMEGA ELECTRONICS, INC.

发明人： NGUYEN, Phong, X. ,  NISSEN, Steven, R.

IPC分类号： H05K1 ,  B32B7 ,  B32B15 ,  H05K3

CPC分类号： H05K1/167 ,  H05K3/062 ,  H05K3/064 ,  H05K3/067 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T428/12854 ,  Y10T428/24917

摘要： A circuit board material (10) is disclosed which includes a support layer (12), at least one electrical resistance layer (14) having a preselected resistivity adhered to the support layer (12), a barrier layer (16) adhered to the electrical resistance layer (14), and a conductive layer (18) adhered to the barrier layer (16). The barrier layer (16) is capable of protecting the resistance layer (14) from attack by alkaline ammoniacal copper etchants. A method of producing the circuit board material (10) is also disclosed.