公开(公告)号：EP4512216A1

公开(公告)日：2025-02-26

申请号：EP23720778.2

申请日：2023-04-13

Applicant: Signify Holding B.V.

Inventor： VAN DER WEL, Pieter, Joseph, Clara

IPC: H05K1/02 ,  H05K1/18

公开(公告)号：EP4512215A1

公开(公告)日：2025-02-26

申请号：EP23709897.5

申请日：2023-02-10

Applicant: Raytheon Company

Inventor： MICOVIC, Miroslav ,  PILLANS, Brandon, W. ,  GAMALSKI, Andrew, D. ,  BROWN, Andrew, K.

IPC: H05K1/02 ,  H01L23/31 ,  H01L23/373 ,  H05K1/18

公开(公告)号：EP4510859A1

公开(公告)日：2025-02-26

申请号：EP23720939.0

申请日：2023-04-20

Applicant: Nicoventures Trading Limited

Inventor： BELL, Sally ,  WANG, Tianyi ,  LI, Zhiping ,  XU, Xiaofeng

IPC: A24F40/51 ,  A24F40/485 ,  H05K1/02 ,  H05K1/18

公开(公告)号：EP4510784A1

公开(公告)日：2025-02-19

申请号：EP23858774.5

申请日：2023-06-02

Applicant: xFusion Digital Technologies Co., Ltd.

Inventor： LIU, Guoqiang ,  JI, Zhongli

IPC: H05K1/18

Abstract: Embodiments of this application provide a computing node and a computing device. The computing node includes a mainboard and a current guiding structure. An electronic component is mounted on a first surface of the mainboard, a through-current hole is disposed in a thickness direction of the mainboard, a hole wall of the through-current hole has a conductive medium, and the through-current hole is electrically connected to the electronic component. The current guiding structure is configured to be connected to a power supply, and is configured to transmit a power supply current output from the power supply, and the current guiding structure is disposed on a side of the mainboard, and is electrically connected to the hole wall of the through-current hole, to transmit the power supply current to the through-current hole in the thickness direction of the mainboard. In this application, because the current guiding structure and the mainboard are structures independent of each other, there is no limitation due to a through-current capability of the mainboard, thereby improving a power supply density of the computing node, and facilitating development of the computing node towards high-density computing power and high-density power.

公开(公告)号：EP4510391A1

公开(公告)日：2025-02-19

申请号：EP24189849.3

申请日：2024-07-19

Applicant: METZ CONNECT TECH GmbH

Inventor： Merk, Benjamin

IPC: H01R13/6466 ,  H05K1/16 ,  H01R24/64 ,  H01R4/2433

Abstract: Elektrischer Verbinder (1) für ein Daten- oder Kommunikationskabel mit folgenden Merkmalen:
- einem Gehäuse (3),
- einer Platine (50), wobei die Platine (50) zumindest teilweise im Gehäuse (3) angeordnet ist,
- die Platine (50) weist mindestens eine differentielle Leitung (53) auf,
- die differentielle Leitung (53) weist eine erste Leiterbahn (51) und eine zweite Leiterbahn (52) auf,
- die erste (51) und zweite Leiterbahn (52) weisen jeweils einen Leitungspfad (57) und erste Kontaktpads (54) und zweite Kontaktpads (55) an den Enden des Leitungspfades (57) auf,
- die zweiten Kontaktpads (55) sind mit zweiten Kontaktelementen (65) elektrisch verbunden,
- mindestens eine Kapazitätsplatte (91) ist auf der Platine (50) ausgebildet,

gekennzeichnet durch die weiteren Merkmale:
- eine einzige Kapazitätsplatte (91) ist zumindest teilweise überlappend mit einem der zweiten Kontaktelemente (65) auf der Platine (50) ausgebildet, wobei die Kapazitätsplatte (91) nicht mit dem überlappenden zweiten Kontaktelement (65) elektrisch verbunden ist.

公开(公告)号：EP4509306A1

公开(公告)日：2025-02-19

申请号：EP23900696.8

申请日：2023-12-06

Applicant: Resonac Corporation

Inventor： KITAJIMA Takayo ,  TONOUCHI Shunsuke ,  MAGOTA Seiya ,  NAKANISHI Kota

IPC: B32B15/08 ,  B32B38/08 ,  C08J5/24 ,  H05K1/03 ,  H05K3/46

Abstract: Provided are a method for producing a metal-clad laminate, including: laminating a prepreg and a metal foil by heating and pressurizing, in which the prepreg contains a thermosetting resin composition and a fiber base material having a thickness of 40 µm or more, the prepreg has a first resin layer which is provided on one surface of the fiber base material and contains the thermosetting resin composition; and a second resin layer which is provided on the other surface of the fiber base material and contains the thermosetting resin composition, in which when a thickness of the first resin layer is d 1 and a thickness of the second resin layer is d 2 , a ratio R of a thickness difference represented by formula (1) is -9.0% to +9.0%, and surface waviness (Wa) of each of both surfaces of the prepreg is 6 µm or less, and a printed wiring board and a semiconductor package using the metal-clad laminate.

公开(公告)号：EP4189302B1

公开(公告)日：2025-02-19

申请号：EP21749638.9

申请日：2021-07-27

Inventor： DELCOURT, Romain ,  DELETANG, Théo ,  NIKOUKAR, Shahram ,  HAMDANI, Abdelmalik

IPC: F24H1/00 ,  F24H9/20 ,  B60H1/22 ,  F24H1/10 ,  H05B3/48 ,  H05B1/02 ,  H05K1/00

公开(公告)号：EP4132235B1

公开(公告)日：2025-02-19

申请号：EP21779171.4

申请日：2021-03-29

Inventor： SAKAMAKI, Marina ,  KUBOTA, Kenji ,  OHASHI, Toyo

IPC: H01L23/14 ,  H05K3/38 ,  H01L23/498 ,  H01L23/373 ,  H05K3/00 ,  H05K1/02

公开(公告)号：EP4060966B1

公开(公告)日：2025-02-19

申请号：EP20904028.6

申请日：2020-12-11

Inventor： LUO, Junchao ,  AN, Wenji ,  YUAN, Zhi ,  LIN, Hongfan ,  JIN, Hanbiao ,  SHAN, Wei

IPC: H04M1/02 ,  H05K1/11 ,  H05K1/02 ,  G06F1/16 ,  H05K1/18

公开(公告)号：EP4507469A1

公开(公告)日：2025-02-12

申请号：EP24751361.7

申请日：2024-06-10

Applicant: Samsung Electronics Co., Ltd

Inventor： KIM, Jongyeon ,  KIM, Minsoo ,  KIM, Yongwoon ,  PARK, Eunsoo

IPC: H05K9/00 ,  C09K5/14 ,  H05K1/02 ,  C09K5/10 ,  H05K1/11

Abstract: A printed circuit board (PCB) (200) may include a first PCB (210); an interposer (230); a second PCB (220); a shield structure (240); and a guide (250) disposed on the first PCB and configured to guide at least a portion of a thermal interface material (TIM) that fills a first inner space (S1) to a second inner space (S2).