公开(公告)号：EP1188183A2

公开(公告)日：2002-03-20

申请号：EP00972110.1

申请日：2000-10-11

申请人： Philips Semiconductor, Inc. ,  Koninklijke Philips Electronics N.V.

发明人： MAGEE, Michael, R. ,  BEER, Michael, D. ,  ERCK, Wesley, R.

IPC分类号： H01L21/66

CPC分类号： G03F7/70433

摘要： A method and system thereof for efficiently computing the number of dies per wafer and the corresponding number of stepper shot counts. Dimensions for a die andthe size of the wafer are received. The dimensions comprise a die element size that is a function of a scribe lane width, a guard ring width, an input/output pad area, and a length and a width of the die. A die count lookup table is selected for the specified wafersize and used to determine the die count corresponding to the die element size. In a similar manner, a stepper shot count lookup table is selected for the specified wafersize and used to determine the stepper shot count corresponding to the die element size. The axes of the die count and stepper shot count lookup tables are incrementedby varying amounts; for example, the increments in one portion of the lookup tables are smaller (finer), and in another portion the increments are larger (grosser). By using larger increments in portions of the lookup tables, the amount of data in the tables canbe reduced, making the tables easier to generate and work with.

摘要翻译： 一种方法和系统，用于有效计算每个晶片的管芯数量和相应的步进式击发次数。 接收模具的尺寸和晶圆的尺寸。 尺寸包括作为划线通道宽度，护环宽度，输入/输出焊盘区域以及管芯的长度和宽度的函数的管芯元件尺寸。 为指定的晶圆选择一个管芯计数查找表并用于确定与管芯元件尺寸相对应的管芯计数。 以类似的方式，为指定的晶圆尺寸选择步进式击发计数查找表并用于确定与模具元件尺寸相对应的步进式击发计数。 管芯计数和步进式计数查找表的轴以不同的量递增; 例如，查找表的一部分中的增量更小（更精细），并且在另一部分中增量更大（更粗）。 通过在查找表的各个部分中使用更大的增量，可以减少表中的数据量，使表更易于生成和使用。

公开(公告)号：EP1210731A2

公开(公告)日：2002-06-05

申请号：EP00989646.5

申请日：2000-10-02

申请人： Koninklijke Philips Electronics N.V. ,  Philips Semiconductors Inc.

发明人： MAGEE, Michael, R. ,  BEER, Michael, D. ,  ERCK, Wesley, R.

IPC分类号： H01L21/66 ,  G03F7/20

CPC分类号： G03F7/70433

摘要： A method and system thereof for efficiently computing the number of dies per wafer and the corresponding number of stepper shots. Dimensions for a die and the size of the wafer are received. The dimensions comprise a die element size that is a function of a scribe lane width, a guard ring width, an input/output pad area, and a length and a width of the die. A die count lookup table is selected for the specified wafer size and used to determine the die count corresponding to the die element size. In a similar manner, a stepper shot count lookup table is selected for the specified wafer size and used to determine the stepper shot count corresponding to the die element size. Because the die element size accounts for the different production parameters, a die count lookup table and a stepper shot count lookup table need to exist only for each wafer size, significantly reducing the number of required lookup tables and correspondingly reducing the amount of storage space and maintenance required.

公开(公告)号：EP1159651A1

公开(公告)日：2001-12-05

申请号：EP00975246.0

申请日：2000-10-13

申请人： Koninklijke Philips Electronics N.V.

发明人： ERCK, Wesley, R. ,  MAGEE, Michael, R. ,  BEER, Michael, D.

IPC分类号： G03F7/20 ,  H01L27/118

CPC分类号： G03F7/70433

摘要： A method and system thereof for maximizing integrated circuit die production. In one embodiment, the method is implemented on a server computer system in aclient-server computer system network. In this embodiment, the server computersystem receives from a client computer system a wafer size, a scribe lane width, andthe dimensions for a die. A die count and a stepper shot count corresponding to thedimensions are determined using one or more of lookup tables. A lookup table isassociated with each combination of wafer size and scribe lane width. A measure ofdie production is calculated using the die count and the stepper shot count andtransmitted to the client computer system. The dimensions can be changed and a newmeasure of die production calculated using the changed dimensions, until a maximumvalue of the measure of die production is determined. A user on the client computersystem is thereby provided with this information while designing the integrated circuitdie, and can advantageously factor this information into the decision on a die size andshape in order to maximize die production.