公开(公告)号：EP1501135A2

公开(公告)日：2005-01-26

申请号：EP04016551.6

申请日：2004-07-14

申请人： Polymatech Co., Ltd.

发明人： Takahashi, Kouya

IPC分类号： H01M2/10

CPC分类号： H01M2/10

摘要： The present invention provides a thermally conductive holder (11) formed from a thermally conductive composition for holding a heat-generating component (12, 26). The thermally conductive composition comprises a silicone rubber; and a thermally conductive filler in a range from 40 to 70 percent by volume with respect to total volume of the silicone rubber and the thermally conductive filler. From 35 to 100 percent by volume of the thermally conductive filler is composed of magnesium oxide of 5 µm or less in average particle size. The thermally conductive holder (11) has a hardness in a range from 20 to 70 as measured by Type A durometer in conformity with ISO 7619.

摘要翻译： 本发明提供一种由用于保持发热部件（12,26）的导热组合物形成的导热保持器（11）。 导热组合物包含硅橡胶; 相对于硅橡胶和导热填料的总体积，40至70体积％的导热填料。 35〜100体积％的导热性填料由平均粒径为5μm以下的氧化镁构成。 导热保持器（11）具有根据ISO 7619的A型硬度计测量的20至70度的硬度。

公开(公告)号：EP1324388A2

公开(公告)日：2003-07-02

申请号：EP02028134.1

申请日：2002-12-18

申请人： Polymatech Co., Ltd.

发明人： Takahashi, Kouya

IPC分类号： H01L23/373

CPC分类号： H01L23/3733 ,  H01L2924/0002 ,  Y10T428/23 ,  Y10T428/31663 ,  H01L2924/00

摘要： A thermally conductive sheet 15 includes a thermally conductive layer 18 and an insulation layer 17 laminated onto the thermally conductive layer 18. The thermally conductive layer 18 includes matrix containing thermally conductive filler having an electrical conductivity. The insulation layer 17 contains thermally conductive filler having an insulating property. The thermally conductive sheet 15 is disposed so that the insulation layer 17 covers the terminal 13 of the electronic component 12 and the electric circuit 14. At this time, the thermally conductive layer 18 covers and closely contacts with the insulation layer 17 and the electronic component 12. The heat generated by the electronic component 12 is conducted to a cooling member 19 through the thermally conductive layer 18 and is ultimately dissipated.

摘要翻译： 导热片15包括导热层18和绝缘层17层压到热传导层18的导热层18包括矩阵含有具有以导电性的导热性填料。 绝缘层17包含具有绝缘性的导热性填料。 导热片15被设置为做的绝缘层17覆盖电子部件12和电路14。此时，导热层18所覆盖并紧密地接触具有绝缘层17和电子部件的端子13 12.由电子元件12所产生的热通过该导热层18传导到冷却部件19，并最终消散。

公开(公告)号：EP1501135B1

公开(公告)日：2011-06-15

申请号：EP04016551.6

申请日：2004-07-14

申请人： POLYMATECH CO., LTD.

发明人： Takahashi, Kouya

IPC分类号： H01M2/10

CPC分类号： H01M2/10

公开(公告)号：EP1324388B1

公开(公告)日：2008-11-05

申请号：EP02028134.1

申请日：2002-12-18

申请人： POLYMATECH CO., LTD.

发明人： Takahashi, Kouya

IPC分类号： H01L23/373 ,  H01L23/433

CPC分类号： H01L23/3733 ,  H01L2924/0002 ,  Y10T428/23 ,  Y10T428/31663 ,  H01L2924/00

公开(公告)号：EP1501135A3

公开(公告)日：2008-07-02

申请号：EP04016551.6

申请日：2004-07-14

申请人： POLYMATECH CO., LTD.

发明人： Takahashi, Kouya

IPC分类号： H01M2/10

CPC分类号： H01M2/10

摘要： The present invention provides a thermally conductive holder (11) formed from a thermally conductive composition for holding a heat-generating component (12, 26). The thermally conductive composition comprises a silicone rubber; and a thermally conductive filler in a range from 40 to 70 percent by volume with respect to total volume of the silicone rubber and the thermally conductive filler. From 35 to 100 percent by volume of the thermally conductive filler is composed of magnesium oxide of 5 µm or less in average particle size. The thermally conductive holder (11) has a hardness in a range from 20 to 70 as measured by Type A durometer in conformity with ISO 7619.

公开(公告)号：EP1324388A3

公开(公告)日：2004-06-16

申请号：EP02028134.1

申请日：2002-12-18

申请人： Polymatech Co., Ltd.

发明人： Takahashi, Kouya

IPC分类号： H01L23/373 ,  H01L23/433

CPC分类号： H01L23/3733 ,  H01L2924/0002 ,  Y10T428/23 ,  Y10T428/31663 ,  H01L2924/00

摘要： A thermally conductive sheet 15 includes a thermally conductive layer 18 and an insulation layer 17 laminated onto the thermally conductive layer 18. The thermally conductive layer 18 includes matrix containing thermally conductive filler having an electrical conductivity. The insulation layer 17 contains thermally conductive filler having an insulating property. The thermally conductive sheet 15 is disposed so that the insulation layer 17 covers the terminal 13 of the electronic component 12 and the electric circuit 14. At this time, the thermally conductive layer 18 covers and closely contacts with the insulation layer 17 and the electronic component 12. The heat generated by the electronic component 12 is conducted to a cooling member 19 through the thermally conductive layer 18 and is ultimately dissipated.