公开(公告)号：EP3860321B1

公开(公告)日：2024-10-02

申请号：EP19865972.4

申请日：2019-09-25

IPC分类号： H01L23/36 ,  C08K7/06 ,  H01L23/42 ,  H01L23/373 ,  C08K3/04 ,  C08K7/00 ,  C08K3/22

CPC分类号： C08K7/00 ,  H01L23/3737 ,  H01L23/3733 ,  H01L23/3731 ,  H01L23/373 ,  H01L23/42 ,  C08K7/06 ,  C08K3/04 ,  C08K2003/222720130101

公开(公告)号：EP3806144B1

公开(公告)日：2024-04-17

申请号：EP20200593.0

申请日：2020-10-07

IPC分类号： H01L23/42 ,  H01L23/373

CPC分类号： H01L23/3733 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/373

公开(公告)号：EP3392906A1

公开(公告)日：2018-10-24

申请号：EP17167066.4

申请日：2017-04-19

申请人： Siemens Aktiengesellschaft

发明人： Danov, Vladimir ,  Ippisch, Stephan ,  Knauer, Hans ,  Kneißl, Philipp

IPC分类号： H01L23/373 ,  H01L23/473 ,  H01L21/48 ,  F28F3/00 ,  F28F7/02 ,  F28F13/00 ,  F28F13/12

CPC分类号： H01L23/473 ,  H01L21/4882 ,  H01L23/3733

摘要： Es wird ein Verfahren zur Herstellung einer Kühlplatte (1) für einen Leistungshalbleiter vorgeschlagen, das die folgenden Schritte umfasst:
- Bereitstellen eines ersten und zweiten Bleches (2, 4);
- Anordnen eines Füllkörpers (42) zwischen dem ersten und zweiten Blech (2, 4);
- Verpressen der Bleche (2, 4) mit dem zwischen den Blechen (2, 4) angeordneten Füllkörper (42); und
- Stoffschlüssiges Verbinden des ersten und zweiten Bleches (2, 4) an ihren jeweiligen Enden.
Weiterhin betrifft die Erfindung ein Modul mit einem Leistungshalbleiter und einer erfindungsgemäß hergestellten Kühlplatte (1) sowie einen Stromrichter mit einem solchen Modul.

公开(公告)号：EP3007531B1

公开(公告)日：2018-10-24

申请号：EP14874601.9

申请日：2014-07-08

申请人： Huawei Technologies Co., Ltd.

发明人： HU, Rui ,  ZHAI, Liqian ,  WANG, Dong ,  CHI, Shanjiu ,  LI, Jinshan ,  SUN, Zhigang

IPC分类号： H01L23/373 ,  H01L21/48 ,  B32B37/06 ,  B32B37/10 ,  F28F21/02 ,  F28F21/08 ,  H01L23/42

CPC分类号： F28F21/02 ,  B32B37/06 ,  B32B37/1018 ,  B32B37/142 ,  B32B2307/302 ,  F28F21/084 ,  H01L21/4882 ,  H01L23/373 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention discloses a thermally conductive composite sheet, including a first aluminum alloy layer, at least one graphite sheet, an aluminum alloy frame, and a second aluminum alloy layer, where the aluminum alloy frame is provided with at least one opening; the graphite sheet is positioned inside the opening of the aluminum alloy frame; the aluminum alloy frame and the graphite sheet are sandwiched between the first aluminum alloy layer and the second aluminum alloy layer; the first aluminum alloy layer is diffusion-bonded to the graphite sheet and the aluminum alloy frame; the second aluminum alloy layer is diffusion-bonded to the graphite sheet and the aluminum alloy frame; and the graphite sheet is cladded by the first aluminum alloy layer, the second aluminum alloy layer, and the aluminum alloy frame, to form a unity. The present invention further provides a method for making the thermally conductive composite sheet. According to the thermally conductive composite sheet and the method for making same that are provided in the present invention, an aluminum alloy and graphite that are highly thermally conductive can be bonded, and production costs are relatively low.

公开(公告)号：EP2894126B1

公开(公告)日：2018-08-01

申请号：EP13834918.8

申请日：2013-09-06

申请人： Tokuyama Corporation

发明人： TAMAGAKI, Megumu ,  KANECHIKA, Yukihiro

IPC分类号： C01B21/072 ,  H01L23/373

CPC分类号： C01B21/0728 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/80 ,  C01P2006/90 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a method for producing a water-resistant aluminum nitride powder capable of adding a good water-resistant property to an aluminum nitride powder wherein yttria exists on a particle surface. The method is for producing a water-resistant aluminum nitride powder by carrying out a treatment to a particle surface of an aluminum nitride powder, the method including the successive steps of (i) making an aluminum nitride powder contact with an acid solution wherein yttria exists at least on a particle surface of the aluminum nitride powder; and (ii) making the aluminum nitride powder contact with a phosphorous acid compound, wherein the amount of yttria which is extracted when the aluminum nitride powder is filtered, washed with water, and dried after the step (i) and is thereafter subjected to extraction with 1 mol/L hydrochloric acid is no more than 1000 mg per 100 g of the aluminum nitride powder.

公开(公告)号：EP3228590A4

公开(公告)日：2018-07-25

申请号：EP15864565

申请日：2015-11-27

申请人： SEKISUI CHEMICAL CO LTD ,  NATIONAL UNIV CORPORATION KUMAMOTO UNIV

发明人： NOZATO SHOJI ,  NAKASUGA AKIRA ,  FUJIWARA AKIHIKO ,  IHARA HIROTAKA ,  TAKAFUJI MAKOTO ,  SATO EISAKU

IPC分类号： C01B32/225 ,  C08K3/04 ,  H01L23/373

CPC分类号： C09K5/14 ,  C01B32/225 ,  C04B35/117 ,  C04B35/536 ,  C04B35/6264 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/425 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/6027 ,  C04B2235/604 ,  C04B2235/606 ,  C04B2235/77 ,  C04B2235/787 ,  C04B2235/9607 ,  C08K3/04 ,  H01L23/3733

摘要： There is provided a thermally conductive sheet having excellent thermal conductivity in the thickness direction of the sheet. A thermally conductive sheet comprising expanded graphite; and orientation-controlling particles, wherein at least part of the expanded graphite is oriented in a direction different from a plane direction of the sheet by the orientation-controlling particles.

公开(公告)号：EP3291294A1

公开(公告)日：2018-03-07

申请号：EP17174442.8

申请日：2017-06-05

申请人： Samsung Electronics Co., Ltd.

发明人： LEE, Dongwook ,  KIM, Sangwon ,  SEOL, Minsu ,  JEONG, Seongjun ,  NAM, Seunggeol ,  PARK, Seongjun ,  SHIN, Hyeonjin

IPC分类号： H01L23/373 ,  H01L23/42 ,  B82Y30/00 ,  B82Y40/00

CPC分类号： H01L23/3733 ,  B82Y30/00 ,  C08K3/042 ,  H01L21/4871 ,  H01L23/3171 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/3738 ,  H01L23/42

摘要： Disclosed are heat dissipation structures using nano-sized graphene fragments such as graphene quantum dots (GQDs) and/or methods of manufacturing the heat dissipation structures. A heat dissipation structure includes a heating element, and a heat dissipation film on the heating element to dissipate heat generated from the heating element, to outside. The heat dissipation film may include GQDs.

摘要翻译： 公开了使用纳米级石墨烯片段（诸如石墨烯量子点（GQD））和/或制造散热结构的方法的散热结构。 散热结构包括加热元件和位于加热元件上的散热膜，用于将由加热元件产生的热量散发到外部。 散热膜可以包括GQD。

公开(公告)号：EP2639827A4

公开(公告)日：2017-12-27

申请号：EP11840114

申请日：2011-11-11

申请人： KITAGAWA IND CO LTD ,  TYK CORP

发明人： KAWAGUCHI YASUHIRO ,  KUBO MASATAKA

IPC分类号： H01L23/373 ,  H01L23/36 ,  H05K7/20

CPC分类号： H05K1/0203 ,  F28F13/003 ,  F28F21/04 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 10 10 Ohm×cm or more and a porosity of 15-50 vol%.

公开(公告)号：EP2713391A3

公开(公告)日：2017-11-08

申请号：EP13185984.5

申请日：2013-09-25

申请人： DOWA METALTECH CO., LTD.

发明人： Ideguchi, Satoru ,  Osanai, Hideyo ,  Kotani, Hirotaka

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L23/373

CPC分类号： F28F21/08 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/3733 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.

摘要翻译： 金属材料的散热板10包括平板部10a，从平板部的一个主表面突出并与平板部一体化的多个柱状突出部10b，以及加强板部件 该材料的熔点比平板部分和柱状突起部分的熔点高，并且布置在布置在平板部分中并靠近平板的一个主表面的区域中 加强构件穿过平板部分以基本上平行于平板部分的一个主表面的方向延伸并且具有暴露于外部的端面，加强构件的除端面之外的整个表面被粘结 直接到达平板部分。

公开(公告)号：EP2269948B1

公开(公告)日：2017-08-02

申请号：EP08721055.5

申请日：2008-02-29

申请人： Fujitsu Limited

发明人： KONDO, Daiyu ,  IWAI, Taisuke ,  YAMAGUCHI, Yoshitaka ,  SOGA, Ikuo

IPC分类号： B82B1/00 ,  C01B32/05 ,  H01L21/3205 ,  H01L23/52 ,  B82Y30/00 ,  B82Y40/00 ,  H01L23/373 ,  H01L21/768 ,  H01L23/532 ,  H05K3/40

CPC分类号： H01L23/53276 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B2202/08 ,  C01B2202/34 ,  H01L21/32051 ,  H01L21/76879 ,  H01L21/76885 ,  H01L23/373 ,  H01L23/3733 ,  H01L23/3735 ,  H01L2221/1094 ,  H01L2924/0002 ,  H05K3/4038 ,  Y10T428/24802 ,  Y10T428/30 ,  H01L2924/00