公开(公告)号：EP2910918A4

公开(公告)日：2016-07-13

申请号：EP13847081

申请日：2013-10-15

申请人： SAGINOMIYA SEISAKUSHO INC ,  FUJI ELECTRIC CO LTD

发明人： ISHIKAWA TAKURO ,  KANAI YUJI ,  MATSUNAMI KAZUHIRO

IPC分类号： G01L9/00 ,  H01L23/522 ,  H01L23/552

CPC分类号： G01L19/069 ,  G01L9/0054 ,  G01L19/0645 ,  G01L19/142 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/00

摘要： When a main body of a sensor chip (1) is in a grounded state, a shield layer (71) constituting a shield electrode formed on a circuit layer (72) is grounded through a resistor (46).

摘要翻译： 当传感器芯片（1）的主体处于接地状态时，形成在电路层（72）上的构成屏蔽电极的屏蔽层（71）通过电阻（46）接地。

公开(公告)号：EP2937168A4

公开(公告)日：2016-09-07

申请号：EP13863870

申请日：2013-09-06

申请人： SAGINOMIYA SEISAKUSHO INC

发明人： HAMABE YOSHIHIRO ,  ISHIKAWA TAKURO

IPC分类号： B23K11/14 ,  B21D39/00 ,  B23K11/00 ,  B23K101/06 ,  B23K103/22 ,  G01L9/00 ,  G01L19/00

CPC分类号： B23K11/14 ,  B23K2201/06 ,  B23K2203/05 ,  B23K2203/22 ,  F16L41/082 ,  F16L41/084 ,  G01L19/003 ,  G01L19/0627

摘要： In a refrigerant circuit component such as a pressure-sensitive device (pressure switch, pressure sensor, etc.) or valve device, the present invention projection-welds a connector (1) to a cap member (2) and prevents intrusion of spatter into a refrigerant circuit. An A-cylinder section (1a) in which an inside hole (1A) of the connector (1) is open is inserted in an inside hole (2A) formed in the center of the cap member (2). The area between the A-cylinder section (1a) and a projection (11d) of the connector (1) is used as a spatter generation space (²). The projection (11d) of the connector (1) abuts against the cap member (2) and is projection-welded to form a welded part (±). The open end (1A1) of the inside hole (1A) of the A-cylinder section (1a) is crimped to pressure-join the open end (1A1) to the open end (2A1) of the inside hole (2A) of the cap member (2). Spatter is sealed inside the spatter generation space (²). A portion of the surface layer to which the generated spatter adheres may be removed by machining to provide a spatter-removed structure.