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公开(公告)号：EP1142666A1
公开(公告)日：2001-10-10
申请号：EP01400249.7
申请日：2001-02-01
发明人： Taguchi, Toshihiko , Takaura, Kunihito , Hirata, Masahiko , Yoshida, Hisahiko , Nagashima, Takashi
CPC分类号： B23K35/3612 , B23K35/025 , B23K35/262 , B23K35/3613
摘要： A solder paste having a powder of a Zn-containing solder alloy such as an Sn-Zn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or aryl glycidyl ether. The improved solder paste has increased resistance to aging and to concomitant deterioration in solderability caused by reaction of Zn in the solder alloy with ingredients in the flux and has a substantially extended shelf life.
摘要翻译： 通过将0.1重量％至5.0重量％的缩水甘油醚化合物，例如添加0.1〜5.0重量％的缩水甘油醚化合物，将具有Sn-Zn系合金等含Zn的锡合金的粉末与助焊剂如松香助熔剂混合的焊膏， 作为烷基，烯基或芳基缩水甘油醚。 改进的焊膏具有增加的老化耐受性，并伴随着焊料合金中的Zn与焊剂中的成分的反应引起的可焊性的劣化，并具有大大延长的保质期。
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公开(公告)号：EP1557235A1
公开(公告)日：2005-07-27
申请号：EP03770084.6
申请日：2003-10-31
申请人： Senju Metal Industry Co., Ltd. , MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , Hirata, Masahiko , Yoshida, Hisahiko , Nagashima, Takashi
IPC分类号： B23K35/26
CPC分类号： B23K35/262 , H05K3/3463
摘要： The present invention provides a Sn-Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn-Zn based lead-free solder according to the present invention comprises 5 - 10 mass percent of Zn, a total of 0.005 - 1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn-Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.
摘要翻译： 本发明提供一种Sn-Zn系无铅焊料，即使在焊接了由Cu制成的部分焊接后的长时间内，也能够防止焊料从焊接部分剥离。 根据本发明的Sn-Zn基无铅焊料包含5〜10质量％的Zn，总计0.005〜1.0质量％的选自Au，Pt，Pd，Fe， 和Sb，任选地总共至多15质量％的选自Bi和In的至少一种物质和余量的Sn。 可以使用含有卤化物如胺盐酸盐作为活化剂的松香助熔剂将该Sn-Zn基无铅焊料制成焊膏。
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公开(公告)号：EP1142666B1
公开(公告)日：2006-04-26
申请号：EP01400249.7
申请日：2001-02-01
发明人： Taguchi, Toshihiko , Takaura, Kunihito , Hirata, Masahiko , Yoshida, Hisahiko , Nagashima, Takashi
CPC分类号： B23K35/3612 , B23K35/025 , B23K35/262 , B23K35/3613
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公开(公告)号：EP0652072A1
公开(公告)日：1995-05-10
申请号：EP94117259.5
申请日：1994-11-02
发明人： Kawashima, Yasuji , Nagashima, Takashi , Matsuike, Akihiko , Meguro, Takeshi , Shimizu, Kaoru , Chaki, Hideo , Ogura, Toshiaki
CPC分类号： B23K35/268 , B23K35/262
摘要： A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.
摘要翻译： 提供了一种锡铅合金焊料，其在可能引起疲劳断裂的条件下表现出高的接合强度。 锡铅合金焊料包含15-80wt。 ％铅，0.1-5重量％ ％银，0.1-10重量％ ％锑和0.0005-0.3磷，余量为锡。
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