公开(公告)号：EP2474025A2

公开(公告)日：2012-07-11

申请号：EP10814358.7

申请日：2010-08-31

申请人： Saint-Gobain Abrasives, Inc. ,  Saint-Gobain Abrasifs

发明人： WU, Jianhui ,  HALL, Richard W. J. ,  SCHULZ, Eric M. ,  RAMANATH, Srinivasan

IPC分类号： H01L21/304

CPC分类号： B24B53/007

摘要： A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.

公开(公告)号：EP2454052A2

公开(公告)日：2012-05-23

申请号：EP10800607.3

申请日：2010-07-16

申请人： Saint-Gobain Abrasives, Inc. ,  Saint-Gobain Abrasifs

发明人： WU, Jianhui ,  ZHANG, Guohua ,  HALL, Richard, W., J.

IPC分类号： B24D3/06 ,  B24D18/00 ,  B24B37/04 ,  B24D3/00 ,  B24B53/12

CPC分类号： B24D18/0054 ,  B24B53/017 ,  B24D3/06 ,  B24D18/0009

摘要： An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 μm/m-°C to about 5.0 μm/m-°C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond.

公开(公告)号：EP2438609A2

公开(公告)日：2012-04-11

申请号：EP10783920.1

申请日：2010-06-01

申请人： Saint-Gobain Abrasives, Inc. ,  Saint-Gobain Abrasifs

发明人： WU, Jianhui ,  HWANG, Taewook ,  VEDANTHAM, Ramanujam ,  DINH-NGOC, Charles ,  PUTHANANGADY, Thomas ,  SCHULZ, Eric, M. ,  RAMANATH, Srinivasan

IPC分类号： H01L21/304

CPC分类号： B24B53/017 ,  B24B53/12 ,  B24D3/08 ,  B24D18/00

摘要： An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

公开(公告)号：EP2652773A2

公开(公告)日：2013-10-23

申请号：EP11849399.8

申请日：2011-12-13

申请人： Saint-Gobain Abrasifs ,  Saint-Gobain Abrasives, Inc.

发明人： WU, Jianhui ,  SCHULZ, Eric, M. ,  RAMANATH, Srinivasan ,  KHAUND, Arup, K.

IPC分类号： H01L21/304

CPC分类号： B24B53/017 ,  B24D3/06 ,  B24D18/00

摘要： A method of forming a chemical mechanical planarization (CMP) pad conditioner includes placing abrasive grains on a major surface of a substrate, forming a binding composition at an exterior surface of the abrasive grains, and depositing a bonding layer over the surface of the substrate and a portion of the abrasive grains to secure the abrasive grains to the major surface of the substrate.

公开(公告)号：EP2411181A1

公开(公告)日：2012-02-01

申请号：EP09842450.0

申请日：2009-12-31

申请人： Saint-Gobain Abrasives, Inc. ,  Saint-Gobain Abrasifs

发明人： DINH-NGOC, Charles ,  RAMANATH, Srinivasan ,  SCHULZ, Eric, M. ,  WU, Jianhui ,  PUTHANANGADY, Thomas ,  VEDANTHAM, Ramanujam ,  HWANG, Taewook

IPC分类号： B24B37/00 ,  B24B53/12 ,  H01L21/304

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/12

摘要： An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.