公开(公告)号：EP2326509A1

公开(公告)日：2011-06-01

申请号：EP08782946.1

申请日：2008-08-19

申请人： Silverbrook Research Pty Ltd

发明人： O'FARRELL, Stephen, Richard ,  WASZCZUK, Jan ,  SLEIJPEN, Stephen, John ,  ANDREW, James ,  STRUDWICKE, Craig, Donald ,  GRANGER, William ,  JANOS, Mark

IPC分类号： B41J2/14 ,  H05K7/02

CPC分类号： B41J2/1623 ,  B41J2/16 ,  B41J2002/14362 ,  B41J2002/14491 ,  B41J2202/19 ,  H05K3/3494 ,  H05K3/361 ,  H05K2201/056 ,  H05K2203/0278

摘要： The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.