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    HEAD CHIP, LIQUID JET HEAD, AND LIQUID JET RECORDING DEVICE
    2.
    发明公开
    HEAD CHIP, LIQUID JET HEAD, AND LIQUID JET RECORDING DEVICE 审中-公开

    公开(公告)号：EP4385740A1

    公开(公告)日：2024-06-19

    申请号：EP23216461.6

    申请日：2023-12-13

    申请人： SII Printek Inc.

    发明人： NAKAYAMA, Hitoshi

    IPC分类号： B41J2/14 ,  B41J2/16

    CPC分类号： B41J2/14209 ,  B41J2002/1449120130101 ,  B41J2002/1436220130101 ,  B41J2202/1220130101 ,  B41J2/1609 ,  B41J2/1646 ,  B41J2/1643 ,  B41J2/1623 ,  B41J2/1632

    摘要： A head chip, a liquid jet head, and a liquid jet recording device each capable of effectively transferring the elastic energy to the ink in the ejection channel to obtain a desired ejection performance are provided. The head chip according to an aspect of the present disclosure includes an actuator plate in which jet channels and non-jet channels are alternately arranged, a side-surface common electrode formed on inner side surfaces opposed to each other in a second direction out of inner surfaces of the jet channel, a bottom-surface common electrode formed on a bottom surface facing to a first side in a thickness direction out of the inner surfaces of the jet channel, a first individual electrode which is formed on inner side surfaces opposed to each other in the second direction out of inner surfaces of the non-jet channel, and which is configured to generate a potential difference from the side-surface common electrode, and a second individual electrode which is disposed on an opposite surface facing to a second side in the thickness direction out of the actuator plate, and which is configured to generate a potential difference from the bottom-surface common electrode.

    HEAD CHIP, LIQUID JET HEAD, AND LIQUID JET RECORDING DEVICE
    3.
    发明公开
    HEAD CHIP, LIQUID JET HEAD, AND LIQUID JET RECORDING DEVICE 审中-公开

    公开(公告)号：EP4382300A1

    公开(公告)日：2024-06-12

    申请号：EP23214563.1

    申请日：2023-12-06

    申请人： SII Printek Inc.

    发明人： NISHIKAWA, Daichi ,  KOYANO, Takanori

    IPC分类号： B41J2/14 ,  B41J2/16

    CPC分类号： B41J2/14209 ,  B41J2202/1220130101 ,  B41J2/1609 ,  B41J2/1632 ,  B41J2002/1449120130101 ,  B41J2/1623 ,  B41J2/1642 ,  B41J2002/1441920130101 ,  B41J2002/1436220130101

    摘要： A head chip (51A) according to an aspect of the present disclosure includes an ejection section (61, 62), a jet hole plate (53), a return plate (52), a flow channel plate (120), and a protective film (125). A communication channel (110) includes an upstream opening (115) communicated with a channel opening which opens toward a first side in a first direction in a jet channel, a downstream opening (116) communicated with a manifold opening which opens toward the first side in the first direction in the manifold (123), and a connecting part (117) which extends in a third direction, and which is configured to connect the upstream opening and the downstream opening to each other. The return plate is bonded to the ejection section so that at least a part of an opening edge (115a-d) in the upstream opening is arranged at an outer side when viewed from the first direction with respect to an opening edge (71c, 71d) of the channel opening.

    LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC DEVICE
    5.
    发明授权
    LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC DEVICE 有权

    公开(公告)号：EP3002126B1

    公开(公告)日：2018-10-17

    申请号：EP15187637.2

    申请日：2015-09-30

    申请人： Seiko Epson Corporation

    发明人： YAZAKI, Shiro

    IPC分类号： B41J2/16 ,  B41J2/14

    CPC分类号： B41J2/14233 ,  B41J2/14 ,  B41J2/14201 ,  B41J2/14274 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2002/14241 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/11

    摘要： A liquid ejecting head (1) includes a flow channel forming substrate (10) that is provided with a space constituting a pressure generating chamber (12) which communicates with nozzle openings (21), a vibration plate (50) that is stacked on one surface of the flow channel forming substrate and seals the space, and a piezoelectric element (300) that includes a first electrode (60), a piezoelectric layer (70), and a second electrode (80) sequentially stacked on a surface of the vibration plate opposite to the flow channel forming substrate, in which the first electrode is formed, in which at least a width of a first direction along the opposite surface is narrower than the space in a region corresponding to the space, the piezoelectric layer is stacked so as to overlap the first electrode and at least a part of the vibration plate in the region corresponding to the space, the second electrode is stacked so as to overlap the piezoelectric layer in the region corresponding to the space, and as a thickness of a stacked direction of the piezoelectric element is a thickness of the piezoelectric layer, a first thickness (D1) of the piezoelectric layer of a part positioned on the first electrode and a second thickness (D2) of the piezoelectric layer of a part positioned on the vibration plate satisfy a relationship of the first thickness (D1) > the second thickness (D2).

    MANUFACTURING METHOD OF FLUID CONTROL DEVICE
    7.
    发明公开
    MANUFACTURING METHOD OF FLUID CONTROL DEVICE 审中-公开
    流体控制装置的制造方法

    公开(公告)号：EP3290210A1

    公开(公告)日：2018-03-07

    申请号：EP17179903.4

    申请日：2017-07-06

    申请人： Microjet Technology Co., Ltd

    发明人： HAN, Yung-Lung ,  HUANG, Chi-Feng

    IPC分类号： B41J2/14 ,  B41J2/16 ,  F04B43/00 ,  F04B43/04 ,  F04B45/04 ,  F04B45/047 ,  F04B53/22 ,  F04D3/00

    CPC分类号： H01L41/25 ,  B05B17/0676 ,  B41J2/14233 ,  B41J2/1623 ,  B41J2002/14362 ,  F04B43/0054 ,  F04B43/04 ,  F04B43/046 ,  F04B45/04 ,  F04B45/047 ,  F04B53/22 ,  F04D3/00

    摘要： A manufacturing method of a fluid control device (2) is provided. Firstly, a housing (26), a piezoelectric actuator (23) and a deformable substrate (20) are provided. The piezoelectric actuator (23) includes a piezoelectric element (233) and a vibration plate (230). The deformable substrate (20) includes a flexible plate (22) and a communication plate (21). A bulge (230c) is formed on the vibration plate (230). The flexible plate (22) includes a movable part (22a). Then, the flexible plate (22) and the communication plate (21) are stacked on and coupled with each other. A preformed synchronous deformation process is implemented. Consequently, a preformed synchronously-deformed structure is defined. Then, the housing (26), the piezoelectric actuator (23) and the deformable substrate (20) which are sequentially stacked on each other are coupled. The preformed synchronously-deformed structure is aligned with the bulge (230c) of the vibration plate (230). Consequently, a specified depth (δ) is defined between the movable part (22a) of the flexible plate (22) and the bulge (230c) of the vibration plate (230).

    摘要翻译： 提供了一种流体控制装置（2）的制造方法。 首先，提供壳体（26），压电致动器（23）和可变形衬底（20）。 压电致动器（23）包括压电元件（233）和振动板（230）。 可变形基板（20）包括柔性板（22）和连通板（21）。 在振动板（230）上形成凸起（230c）。 柔性板（22）包括可动部分（22a）。 然后，柔性板（22）和连通板（21）堆叠在一起并彼此连接。 预先形成的同步变形过程被执行。 因此，定义了预先形成的同步变形结构。 然后，将彼此顺序堆叠的壳体（26），压电致动器（23）和可变形基板（20）耦合。 预先形成的同步变形结构与振动板（230）的凸起（230c）对齐。 因此，在可挠板（22）的可动部（22a）与振动板（230）的凸部（230c）之间形成规定的深度（δ）。

    STRUCTURE MANUFACTURING METHOD AND LIQUID DISCHARGE HEAD SUBSTRATE MANUFACTURING METHOD
    8.
    发明公开
    STRUCTURE MANUFACTURING METHOD AND LIQUID DISCHARGE HEAD SUBSTRATE MANUFACTURING METHOD 审中-公开

    公开(公告)号：EP2493809A4

    公开(公告)日：2018-03-07

    申请号：EP11732787

    申请日：2011-01-13

    申请人： CANON KK

    发明人： TERASAKI ATSUNORI ,  KUBOTA MASAHIKO ,  KANRI RYOJI ,  FUKUMOTO YOSHIYUKI

    IPC分类号： B81C1/00 ,  B41J2/16

    CPC分类号： B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639 ,  B41J2/1642

    摘要： A method for processing a silicon substrate includes providing a combination of a first silicon substrate, a second silicon substrate, and an intermediate layer including a plurality of recessed portions, which is provided between the first silicon substrate and the second silicon substrate, forming a first through hole that goes through the first silicon substrate by executing etching of the first silicon substrate on a surface of the first silicon substrate opposite to a bonding surface with the intermediate layer by using a first mask, and exposing a portion of the intermediate layer corresponding to the plurality of recessed portions of the intermediate layer, forming a plurality of openings on the intermediate layer by removing a portion constituting a bottom of the plurality of recessed portions, and forming a second through hole that goes through the second silicon substrate by executing second etching of the second silicon substrate by using the intermediate layer on which the plurality of openings are formed as a mask.