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公开(公告)号：EP2326508A1
公开(公告)日：2011-06-01
申请号：EP08782945.3
申请日：2008-08-19
发明人： SLEIJPEN, Stephen, John , ANDREW, James , BOWYER, Graeme, Kenneth , GRANGER, William , WASZCZUK, Jan , BURKE, David, Oliver , STRUDWICKE, Craig, Donald , THELANDER, Jason, Mark
CPC分类号： B41J2/16 , B32B38/1841 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , B41J2202/19
摘要： The invention relates to a laminating apparatus for laminating a printhead integrated circuit (IC) carrier sub-assembly and a lamination film. The apparatus includes a lamination support for receiving the carrier, a lamina supply for supplying a lamina defining said lamination film, and an alignment mechanism configured to align the lamination film with the IC carrier sub- assembly. Also included is a bonding apparatus configured to bond the lamination film to the IC carrier sub-assembly, and a control system to control operation of the lamina supply, alignment mechanism and bonding apparatus to facilitate automatic bonding of the lamination film to the surface of the carrier.
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公开(公告)号：EP2326509A1
公开(公告)日：2011-06-01
申请号：EP08782946.1
申请日：2008-08-19
发明人： O'FARRELL, Stephen, Richard , WASZCZUK, Jan , SLEIJPEN, Stephen, John , ANDREW, James , STRUDWICKE, Craig, Donald , GRANGER, William , JANOS, Mark
CPC分类号： B41J2/1623 , B41J2/16 , B41J2002/14362 , B41J2002/14491 , B41J2202/19 , H05K3/3494 , H05K3/361 , H05K2201/056 , H05K2203/0278
摘要： The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.
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