公开(公告)号：EP1953181A1

公开(公告)日：2008-08-06

申请号：EP06798229.8

申请日：2006-09-21

申请人： Sumitomo Bakelite Company, Ltd.

发明人： ENOKI, Takashi ,  IZUMI, Atsushi ,  OKI, Hiromi ,  ONO, Yukiharu ,  FUJITA, Kazuyoshi

IPC分类号： C08G73/22 ,  C09D5/25 ,  C09D179/04 ,  H01L21/312 ,  H01L21/768 ,  H01L23/522

CPC分类号： H01L21/02205 ,  C08G73/22 ,  C09D179/04 ,  H01L21/02118 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/31695 ,  Y10T428/269

摘要： Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

摘要翻译： 公开了一种树脂组合物，其包含具有通过使二氨基苯酚化合物和二羧酸化合物反应获得的第一重复单元的苯并恶唑树脂前体和交联剂，其中至少一种双氨基苯酚化合物和二羧酸化合物具有类金刚石结构 。 苯并恶唑树脂前体还包含通过使不具有类金刚石结构的二氨基苯酚化合物与不具有金刚石结构的二羧酸化合物反应获得的第二重复单元。 还公开了包含树脂组合物的树脂膜。

公开(公告)号：EP2000510B1

公开(公告)日：2012-05-02

申请号：EP07738876.7

申请日：2007-03-16

申请人： Sumitomo Bakelite Company, Ltd.

发明人： FUJITA, Kazuyoshi ,  IZUMI, Atsushi ,  YAMANOI, Yumiko ,  HARADA, Takahiro ,  OKI, Hiromi ,  ONO, Yukiharu

IPC分类号： C08L101/02 ,  C08G73/10 ,  C08G73/22 ,  H01L21/312

CPC分类号： H01L21/02118 ,  C08G63/19 ,  C08L65/00 ,  H01L21/02282 ,  H01L21/312

摘要： A main object of the present invention is to provide a res in composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semicond uctor device using the same. In the present invention, the object is achieved by a resi n composition comprising a compound having a structure represent ed by formula (1) and a crosslinking agent: wherein in formula (1), R 0 is a single bond or has a structure re presented by formula (2); R 1 to R 8 are respectively any of hydrog en, a group having an alicyclic structure, an organic group havi ng 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and "X" is any of -O-, -NHCO-, -CONH-, -COO- and -OCO-; further, wherein in fo rmula (2), "Ar" is an aromatic group; "Y" is any of a single bond , -O-, -S-, -OCO- and -COO-; "q" is an integer of 1 or more; R 9 i s hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when "q" is a n integer of 2 or more; at least one of R 1 to R 8 is the group havi ng an alicyclic structure when R 0 is a single bond; at least one of R 1 to R 9 is the group having an alicyclic structure when R 0 has the structure represented by formula (2); and "*" and "**" repr esent a position to be bonded to a different chemical structure.

公开(公告)号：EP2000510A1

公开(公告)日：2008-12-10

申请号：EP07738876.7

申请日：2007-03-16

申请人： Sumitomo Bakelite Company, Ltd.

发明人： FUJITA, Kazuyoshi ,  IZUMI, Atsushi ,  YAMANOI, Yumiko ,  HARADA, Takahiro ,  OKI, Hiromi ,  ONO, Yukiharu

IPC分类号： C08L101/02 ,  C08G73/10 ,  C08G73/22 ,  H01L21/312

CPC分类号： H01L21/02118 ,  C08G63/19 ,  C08L65/00 ,  H01L21/02282 ,  H01L21/312

摘要： A main object of the present invention is to provide a res in composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semicond uctor device using the same.
In the present invention, the object is achieved by a resi n composition comprising a compound having a structure represent ed by formula (1) and a crosslinking agent:


wherein in formula (1), R 0 is a single bond or has a structure re presented by formula (2); R 1 to R 8 are respectively any of hydrog en, a group having an alicyclic structure, an organic group havi ng 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and "X" is any of -O-, -NHCO-, -CONH-, -COO- and -OCO-; further, wherein in fo rmula (2), "Ar" is an aromatic group; "Y" is any of a single bond , -O-, -S-, -OCO- and -COO-; "q" is an integer of 1 or more; R 9 i s hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when "q" is a n integer of 2 or more; at least one of R 1 to R 8 is the group havi ng an alicyclic structure when R 0 is a single bond; at least one of R 1 to R 9 is the group having an alicyclic structure when R 0 has the structure represented by formula (2); and "*" and "**" repr esent a position to be bonded to a different chemical structure.

摘要翻译： 本发明的主要目的是提供具有高耐热性和低介电常数的组合物，其清漆，其树脂膜和使用其的半导体器件。 在本发明中，本发明的目的是通过包含具有由式（1）表示的结构的化合物和交联剂的组合物来实现的：其中在式（1）中，R 0是单键或具有结构 由公式（2）表示; R 1〜R 8分别是具有脂环结构的基团，除了具有脂环结构，羟基和羧基的基团以外的1〜10个碳原子的有机基团中的任一个。 “X”是-O - ， - NHCO - ， - CONH - ， - COO-和-OCO-; 其中在式（2）中，“Ar”为芳基; “Y”为单键，-O - ， - S - ， - OCO-和-COO-; “q”为1以上的整数， R 9是氢或具有1个以上碳原子的有机基团，当“q”为2以上的n整数时，可以相同或不同。 当R 0为单键时，R 1至R 8中的至少一个为具有脂环结构的基团; 当R 0具有由式（2）表示的结构时，R 1至R 9中的至少一个为具有脂环结构的基团。 和“*”和“**”表示与不同化学结构键合的位置。