公开(公告)号：EP4398289A1

公开(公告)日：2024-07-10

申请号：EP22864133.8

申请日：2022-07-29

申请人： FUJIFILM Corporation

发明人： NOZAKI, Atsuyasu ,  TAKASHIMA, Misaki ,  SATO, Naoki ,  NAKAMURA, Atsushi

IPC分类号： H01L21/312 ,  C08G73/10 ,  G03F7/027 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  G03F7/037 ,  G03F7/038 ,  G03F7/42

CPC分类号： G03F7/027 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L21/02118 ,  H01L21/02282 ,  G03F7/0387 ,  G03F7/38 ,  G03F7/325 ,  C08G69/265 ,  C08G69/40 ,  C09D177/06 ,  C08F290/145 ,  G03F7/037 ,  G03F7/0388 ,  G03F7/405 ,  G03F7/425

摘要： There is provided a manufacturing method for a cured substance, which makes it possible to obtain a cured substance having excellent breaking elongation, a manufacturing method for a laminate, including the manufacturing method for a cured substance, a manufacturing method for a semiconductor device, including the manufacturing method for a cured substance or the manufacturing method for a laminate, and there is provided a treatment liquid that is used in the manufacturing method for a cured substance.
The manufacturing method for a cured substance includes a film forming step of applying a resin composition containing a precursor of a cyclization resin onto a base material to form a film, a treatment step of bringing a treatment liquid into contact with the film, and a heating step of heating the film after the treatment step, in which the treatment liquid contains at least one compound selected from the group consisting of a basic compound having an amide group and a base generator having an amide group.

公开(公告)号：EP3336127A1

公开(公告)日：2018-06-20

申请号：EP17205305.0

申请日：2017-12-04

申请人： Rohm and Haas Electronic Materials LLC

发明人： WANG, Qing Min ,  MICHAEL-SAPIA, Elizabeth K. ,  GILMORE, Christopher ,  DING, Ping ,  KIM, Young-Seok

IPC分类号： C08G61/10 ,  C08G61/12 ,  C09D165/02 ,  C08L65/02 ,  H01L23/532

CPC分类号： C08G61/128 ,  C08G61/10 ,  C08G61/12 ,  C08G2261/135 ,  C08G2261/1426 ,  C08G2261/228 ,  C08G2261/312 ,  C08G2261/46 ,  C08G2261/64 ,  C08G2261/65 ,  C08G2261/76 ,  C08L65/02 ,  C09D165/02 ,  H01L21/02118 ,  H01L21/02282 ,  H01L23/145 ,  H01L23/5329

摘要： Polyarylene polymers formed from an aromatic dialkyne monomer having a solubility enhancing moiety and having relatively high weight average molecular weights and a relatively low polydispersity show improved solubility in certain organic solvents and are useful in forming relatively thick dielectric material layers in a single coating step.

公开(公告)号：EP3311393A1

公开(公告)日：2018-04-25

申请号：EP16815145.4

申请日：2016-06-21

申请人： Brewer Science Inc.

发明人： ZHONG, Xing-Fu ,  HUANG, Runhui ,  ZHANG, Boyu

IPC分类号： H01L21/027 ,  H01L21/768 ,  G03F1/22 ,  G03F1/48 ,  G03F7/26 ,  G03F7/004

CPC分类号： H01L21/0337 ,  C09D125/08 ,  C09D131/02 ,  C09D179/08 ,  H01L21/02118 ,  H01L21/02282

摘要： Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.

公开(公告)号：EP3227390A4

公开(公告)日：2018-04-25

申请号：EP15865152

申请日：2015-11-22

申请人： HONEYWELL INT INC

发明人： PANDEY YAMINI ,  KENNEDY JOSEPH T ,  XU HELEN X

IPC分类号： C08L83/08

CPC分类号： C08G77/50 ,  C08F130/08 ,  C08K3/36 ,  C09D143/04 ,  C09D183/14 ,  G03F7/0752 ,  G03F7/091 ,  G03F7/094 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02211 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/31111

摘要： A composition comprising a carbosilane polymer formed from at least one carbosilane monomer and at least one carbonyl contributing monomer. In some embodiments, the composition is suitable as gap filling and planarizing material, and may optionally include at least one chromophore for photolithography applications.

公开(公告)号：EP3308395A1

公开(公告)日：2018-04-18

申请号：EP16905307.1

申请日：2016-11-24

申请人： BOE Technology Group Co., Ltd. ,  Hefei Xinsheng Optoelectronics Technology Co., Ltd

发明人： ZOU, Zhixiang ,  YANG, Chengshao ,  SONG, Botao ,  HUANG, Yinhu

IPC分类号： H01L21/77 ,  H01L27/12

CPC分类号： H01L27/1248 ,  G02F1/133345 ,  G02F1/13439 ,  G02F1/136227 ,  G02F1/1368 ,  G02F2001/133357 ,  G02F2001/13685 ,  G02F2202/02 ,  G02F2202/10 ,  G02F2202/103 ,  G02F2202/104 ,  H01L21/02118 ,  H01L21/0212 ,  H01L21/02334 ,  H01L21/0234 ,  H01L27/1222 ,  H01L27/1259 ,  H01L27/1262 ,  H01L27/3258 ,  H01L27/3262 ,  H01L27/3274 ,  H01L29/78666 ,  H01L29/78669 ,  H01L29/78675 ,  H01L29/78678 ,  H01L29/7869 ,  H01L51/0541 ,  H01L51/0545

摘要： The present application discloses a method of fabricating a display substrate having an organic layer for reducing parasitic capacitance between electrodes in different layers. The method includes forming the organic layer on a base substrate; subjecting the organic layer to a surface treatment process to descum organic residues from a surface of the organic layer; and forming a passivation layer on a side of the organic layer distal to the base substrate subsequent to subjecting the organic layer to the surface treatment process.

公开(公告)号：EP2939996B1

公开(公告)日：2018-03-21

申请号：EP13867230.8

申请日：2013-12-27

申请人： Tosoh Corporation ,  Sagami Chemical Research Institute

发明人： ASANO, Sachio ,  KINOSHITA, Tomoyuki ,  HARA, Yasushi ,  HARA, Daiji ,  TANAKA, Ryoji ,  TADA, Ken-ichi

IPC分类号： C07C31/28 ,  C07C29/68 ,  C07C33/26 ,  H01L21/28 ,  H01L21/288 ,  H01L21/316 ,  C07F9/00

CPC分类号： C07F9/005 ,  C07C29/68 ,  C07C31/28 ,  C07C33/26 ,  C07F9/00 ,  H01L21/02118 ,  H01L21/02175 ,  H01L21/02183 ,  H01L21/02194 ,  H01L21/02282 ,  H01L21/02318

摘要： Provided is a compound useful for the manufacture of a Group 5 metal oxide film. The compound is a Group 5 metal oxo-alkoxo complex represented by general formula (A). A material solution for film formation purposes, which comprises the compound and an organic solvent, is prepared. A Group 5 metal oxide film can be manufactured using the material solution for film formation purposes. M±(µ4-O)²(µ3-O)³(µ-O)´(µ-ORA)µ(ORA)¶(RAOH)·X¸Y (A) (wherein M represents a niobium atom or the like; RA represents an alkyl group; X represents an alkylenedioxy group; Y represents a carboxy group or the like; ± represents an integer of 3 to 10; ² represents an integer of 0 to 1; ³ represents an integer of 0 to 8; ´ represents an integer of 2 to 9; µ represents an integer of 0 to 6; ¶ represents an integer of 6 to 16; · represents an integer of 0 to 4; ¸ represents an integer of 0 to 2; and represents an integer of 0 to 6).

公开(公告)号：EP2133743B1

公开(公告)日：2018-01-24

申请号：EP08721428.4

申请日：2008-03-06

申请人： Hitachi Chemical DuPont Microsystems, Ltd.

发明人： MINEGISHI, Tomonori ,  NOGITA, Rika ,  IWASHITA, Kenichi

IPC分类号： G03F7/023 ,  C08G73/10 ,  C08G73/22 ,  G03F7/004 ,  H01L21/027

CPC分类号： H01L21/02118 ,  C08G69/26 ,  C08G69/28 ,  C08G73/22 ,  C08L77/06 ,  C08L79/04 ,  G03F7/0233 ,  H01L21/02282 ,  H01L21/312

摘要： To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I) : wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating.

公开(公告)号：EP3244443A1

公开(公告)日：2017-11-15

申请号：EP17000764.5

申请日：2017-05-03

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Tagami, Shohei ,  Sugo, Michihiro

IPC分类号： H01L21/321 ,  H01L21/48 ,  H01L21/683 ,  H01L21/768

CPC分类号： H01L22/12 ,  C09D183/04 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/4846 ,  H01L21/6835 ,  H01L21/7684 ,  H01L21/7688 ,  H01L23/293 ,  H01L23/3171

摘要： The present invention provides a wafer processing laminate including a wafer having a surface on which unevenness and/or a protective organic film layer (A) is formed, and an organic film layer (B) with a film thickness of less than 100 nm formed on the wafer, the organic film layer (B) including a fluorescent agent that emits visible light by irradiation with ultraviolet light. This provides a wafer processing laminate in which the coverage of the thin film can be checked by a nondestructive and convenient method to make it possible to reuse the wafer, even when the thin film with a film thickness of less than 100 nm is formed onto a wafer having an uneven surface on which a circuit is formed and/or an organic film as an underlayment.

摘要翻译： 本发明提供一种晶片加工用层叠体，该晶片加工用层叠体具有形成有凹凸和/或保护用有机薄膜层（A）的表面的晶片和在其上形成有膜厚小于100nm的有机薄膜层（B） 晶片，有机膜层（B）包括通过用紫外光照射而发射可见光的荧光剂。 这提供了一种晶片加工层压板，其中可以通过非破坏性和便利的方法检查薄膜的覆盖率，以使得可以重新使用晶片，即使当薄膜厚度小于100nm的薄膜形成在 具有其上形成有电路的不平坦表面的晶片和/或作为垫层的有机膜。

公开(公告)号：EP3216046A1

公开(公告)日：2017-09-13

申请号：EP15856201.7

申请日：2015-11-06

申请人： Texas Instruments Incorporated

发明人： GUO, Honglin ,  TAYLOR, Tim, A. ,  WEST, Jeff, A. ,  JACKSON, Ricky, A. ,  WILLIAMS, Byron

IPC分类号： H01L21/02 ,  H01L21/033 ,  H01L51/05 ,  H01L51/56

CPC分类号： H01L21/02118 ,  H01G4/14 ,  H01G4/18 ,  H01G4/224 ,  H01G4/236 ,  H01G4/33 ,  H01L21/02164 ,  H01L21/02178 ,  H01L21/0228 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3192 ,  H01L23/564 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L28/40 ,  H01L51/00 ,  H01L2224/02166 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/04042 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2224/45099

摘要： It has been discovered that poor TDDB reliability of microelectronic device capacitors with organic polymer material in the capacitor dielectric is due to water molecules infiltrating the organic polymer material when the microelectronic device is exposed to water vapor in the operating ambient. Water molecule infiltration from water vapor in the ambient is effectively reduced by a moisture barrier comprising a layer of aluminum oxide formed by an atomic layer deposition (ALD) process. A microelectronic device includes a capacitor with organic polymer material in the capacitor dielectric and a moisture barrier with a layer of aluminum oxide formed by an ALD process.

摘要翻译： 已经发现，当微电子器件暴露于工作环境中的水蒸汽时，电容器电介质中具有有机聚合物材料的微电子器件电容器的差的TDDB可靠性是由于水分子渗入有机聚合物材料。 通过包括通过原子层沉积（ALD）工艺形成的氧化铝层的防潮层有效地降低环境中水蒸气的水分子渗透。 微电子器件包括在电容器电介质中具有有机聚合物材料的电容器以及具有通过ALD工艺形成的氧化铝层的防潮层。

公开(公告)号：EP2941781B1

公开(公告)日：2017-08-09

申请号：EP14761040.6

申请日：2014-03-04

申请人： Canon Kabushiki Kaisha

发明人： KITAGAWA, Kenji ,  ITO, Toshiki

IPC分类号： H01L21/027 ,  B29C59/02 ,  C08F2/48 ,  C09K3/00 ,  C07C311/17 ,  B29L31/34 ,  B29D11/00 ,  B29C35/08 ,  B29K33/00 ,  B29C59/00 ,  C07C311/44 ,  C08K5/435 ,  G03F7/00 ,  G03F7/004 ,  H01L21/02

CPC分类号： C08K5/435 ,  B29C35/0805 ,  B29C59/005 ,  B29C59/026 ,  B29D11/00865 ,  B29K2033/12 ,  B29L2031/3425 ,  C07C311/17 ,  C07C311/44 ,  C08F2/48 ,  G03F7/0002 ,  G03F7/0046 ,  H01L21/02118 ,  H01L21/0274 ,  Y10T428/24612