-
公开(公告)号:EP3943533B1
公开(公告)日:2024-09-04
申请号:EP20773222.3
申请日:2020-03-09
CPC分类号: C08J9/18 , C08J9/0066 , C08J2205/04420130101 , C08J9/232 , C08J9/122 , C08J2203/0620130101 , C08J2323/1620130101 , B29C44/3461
-
公开(公告)号:EP4101628B1
公开(公告)日:2024-07-31
申请号:EP21751204.5
申请日:2021-01-21
-
公开(公告)号:EP2955015B1
公开(公告)日:2018-10-17
申请号:EP15756540.9
申请日:2015-03-10
CPC分类号: C08J9/232 , B32B3/30 , B32B5/022 , B32B5/024 , B32B5/026 , B32B5/16 , B32B5/30 , B32B27/08 , B32B2260/046 , B32B2264/025 , B32B2264/0257 , B32B2264/0285 , B32B2272/00 , C08J5/042 , C08J5/24 , C08J9/0066 , C08J9/0095 , C08J9/141 , C08J9/16 , C08J9/18 , C08J9/224 , C08J9/36 , C08J2201/03 , C08J2203/14 , C08J2203/146 , C08J2325/14 , C08J2363/00 , C08J2367/02
摘要: A resin composite in which a fiber-reinforced resin material comprising fibers and a resin, and a resin expanded body are integrally laminated, wherein the resin expanded body has a hole opened at the interface with the fiber-reinforced resin material and resin of the fiber-reinforced resin material is caused to flow into the hole.
-
公开(公告)号:EP3023454B1
公开(公告)日:2018-08-22
申请号:EP15770324.0
申请日:2015-03-20
申请人: JSP Corporation
CPC分类号: C08J9/18 , C08J9/0061 , C08J9/122 , C08J9/16 , C08J9/232 , C08J2203/06 , C08J2205/052 , C08J2323/14 , C08J2323/16 , C08J2400/16 , C08J2409/06 , C08J2423/14 , C08J2423/16 , C08J2453/02 , C08J2467/00 , C08J2467/04
摘要: The present invention relates to polyolefin resin expanded beads containing multi-layer expanded beads containing a core layer in a foamed state containing a polyolefin resin and a cover layer coated on the core layer, the cover layer containing a mixed resin of a polyolefin resin (A) and at least one resin (B) selected from a polystyrene resin and a polyester resin, and the mixed resin having a weight ratio (A/B) of the polyolefin resin (A) and the resin (B) of from 15/85 to 90/10, and a composite laminated body using an expanded beads molded body thereof, and the expanded beads molded body is excellent in solvent resistance and also excellent in adhesiveness to a thermosetting resin on the surface of the molded body, and can provide a composite laminated body excellent in productivity with a thermosetting resin.
-
公开(公告)号:EP3272797A4
公开(公告)日:2018-08-01
申请号:EP16764713
申请日:2016-03-03
申请人: BANDO CHEMICAL IND
发明人: ICHIKI TOMOHITO , JINDAI SAKI
CPC分类号: C08J9/0066 , C08J9/0061 , C08J9/122 , C08J9/18 , C08J9/34 , C08J2201/03 , C08J2203/06 , C08J2203/08 , C08J2205/044 , C08J2205/046 , C08J2205/052 , C08J2300/16 , C08J2323/06 , C08J2323/12 , C08J2367/04 , C08J2400/104 , C08J2400/16 , C08J2401/02 , C08J2423/06 , C08J2423/12 , C08J2423/26 , C08J2427/18 , C08J2467/04
摘要: The present invention provides a foamable resin composition excellent in terms of the dispersibility and moldability. The foamable resin composition containing: from 30 to 80 wt% of a polyolefin; from 3 to 40 wt% of a polylactic acid; from 1 to 20 wt% of a modified polyolefin containing a carbonyl group in a molecule; from 10 to 40 wt% of a layered silicate; and from 0.01 to 0.5 wt% of a filler, the polyolefin containing at least one of polypropylene and polyethylene, the filler having a density different from the density of the layered silicate by at least 0.20 g/cm 3 .
-
公开(公告)号:EP3199580A4
公开(公告)日:2018-05-16
申请号:EP15843592
申请日:2015-09-14
申请人: KANEKA CORP
发明人: SUZUKI KIRITO , TAMURA MITSUHIRO , HENMI TATSUYA
CPC分类号: B22C7/023 , C08F220/14 , C08J9/141 , C08J9/18 , C08J9/20 , C08J9/228 , C08J9/232 , C08J2201/026 , C08J2203/14 , C08J2203/182 , C08J2203/202 , C08J2207/00 , C08J2333/08 , C08J2333/12 , C08L33/12 , C08F2220/1825 , C08F2222/1013
摘要: The present invention addresses the problem of providing a me thyl methacrylate expanded mold article that rarely generates smoke and soot upon ignition, that can be expanded at a high expansion ra tio, and that is hardly broken upon deformation. The problem is sol ved by an expandable poly methyl methacrylate particle comprising a polymer obtained from 100 parts by weight of an acrylic monomer, a nd not less than 0.05 parts by weight and not more than 0.15 parts b y weight of a polyfunctional monomer, wherein the acrylic monomer c omprises not less than 90% by weight and not more than 98% by weight of methyl methacrylate and not less than 2% by weight and not more than 10% by weight of an C 2-8 alkyl acrylate.
-
7.
公开(公告)号:EP3202836A4
公开(公告)日:2018-05-09
申请号:EP15848048
申请日:2015-09-16
申请人: KANEKA CORP
发明人: IIDA ATSUSHI , SUZUKI KIRITO , HENMI TATSUYA
CPC分类号: C08L25/04 , B32B27/22 , C01P2004/61 , C08J9/141 , C08J9/18 , C08J9/224 , C08J9/232 , C08J2203/14 , C08J2325/12 , C08L9/02 , C09D17/003
摘要: An in-mold expanded mold article can be produced inexpensively and easily by using the expandable polystyrene-type resin particles. However, expanded mold articles are not sufficient in dimensional stability under a high-temperature environment for a long period of time upon use of relatively-high-temperature applications such as a thermal insulating material for pipes, a heat-insulating material for roofs, an automotive member, a thermal insulating material for solar systems or the like because the monomer that forms the polymer in the expanded mold article is styrene. The expansion-molded polystyrene article has thus a drawback that it is not suitable for those applications which require heat resistance as a disadvantage. Further, even higher heat-resistant performance is required in these application fields in recent years. The object of the present invention is to provide an expandable thermoplastic resin particle having improved heat resistance. The problem is solved by an expandable thermoplastic resin particle comprising a polymer obtained from a monomer composition comprising 60 to 80 parts by weight of ±-methylstyrene and 40 to 20 parts by weight of acrylonitrile, wherein a content of residual monomeric components in the particle is not more than 0.5% by weight.
-
公开(公告)号:EP2978801B1
公开(公告)日:2018-03-07
申请号:EP13717579.0
申请日:2013-03-28
IPC分类号: C08J9/18 , C08J9/22 , C08J9/232 , C08G63/08 , C08G101/00
CPC分类号: C08J9/232 , C08J9/122 , C08J9/18 , C08J9/22 , C08J9/36 , C08J2203/06 , C08J2367/04 , C08J2423/00 , C08J2467/00 , C08L67/04 , C08L23/02 , C08L67/00
摘要: The present invention relates to a method for the preparation of PLA beads, more particularly expanded PLA bead foams. In addition, the present invention relates to a method for the preparation of moldings by sintering PLA beads. The method comprises the following steps: A) providing unfoamed PLA pellets, B) heating said unfoamed PLA pellets to an annealing temperature and saturating with a blowing agent, C) maintaining said PLA pellets on the annealing temperature and saturating with said blowing agent, D) depressurizing and cooling the saturated PLA pellets of step C) to room temperature to form expanded PLA bead foams.
-
公开(公告)号:EP3275928A1
公开(公告)日:2018-01-31
申请号:EP16772567.0
申请日:2016-03-24
申请人: Kaneka Corporation
发明人: HAYASE, Yuki
CPC分类号: C08J9/24 , B29C44/00 , B29C44/08 , B29C44/3461 , B29C44/445 , B29K2023/06 , B29K2105/04 , B29K2995/0063 , B29K2995/0097 , C08J9/0023 , C08J9/0028 , C08J9/0066 , C08J9/0095 , C08J9/122 , C08J9/125 , C08J9/18 , C08J9/232 , C08J2201/032 , C08J2201/034 , C08J2203/06 , C08J2203/10 , C08J2203/182 , C08J2205/06 , C08J2323/06 , C08J2323/08 , C08K3/34 , C08K5/103 , C08L23/06 , C08L23/08
摘要: A method of producing a polyethylene resin expanded molded product having a density of 0.017 g/cm 3 to 0.021 g/cm 3 and having a thickness of 10 mm to 40 mm, the method including the steps of: (a) filling a mold with expanded polyethylene resin particles; and (b) heating the expanded polyethylene resin particles so that the expanded polyethylene resin particles are fused to each other, to form the polyethylene resin expanded molded product, the expanded polyethylene resin particles, with which the mold is filled, containing a polyethylene resin, a cell nucleating agent, a polyhydric alcohol fatty acid ester, and a hydrophilic compound, the expanded polyethylene resin particles containing the cell nucleating agent in an amount of not less than 0.08 parts by weight and not more than 0.25 parts by weight, the polyhydric alcohol fatty acid ester in an amount of not less than 0.3 parts by weight and not more than 0.8 parts by weight, and the hydrophilic compound in an amount of not less than 0.01 parts by weight and not more than 10 parts by weight, relative to 100 parts by weight of the polyethylene resin, each of the expanded polyethylene resin particles having a weight of not less than 2.5 mg and not more than 3.5 mg, in the step (a), an internal pressure of 0.12 MPa to 0.16 MPa being applied to the expanded polyethylene resin particles.
摘要翻译: 一种制造密度为0.017g / cm 3至0.021g / cm 3并且厚度为10mm至40mm的聚乙烯树脂发泡成型体的方法,该方法包括以下步骤:(a)用膨胀型聚乙烯 树脂颗粒; 和(b)将发泡聚乙烯树脂颗粒加热以使发泡聚乙烯树脂颗粒彼此熔合以形成聚乙烯树脂发泡成型体,填充模具的发泡聚乙烯树脂颗粒包含聚乙烯树脂, 细胞成核剂,多元醇脂肪酸酯和亲水性化合物,所述含有细胞成核剂的发泡聚乙烯树脂颗粒的量不小于0.08重量份且不大于0.25重量份,所述多元醇 脂肪酸酯为0.3重量份以上且0.8重量份以下,亲水性化合物的量为0.01重量份以上10重量份以下,相对于100重量份 重量份的聚乙烯树脂,在步骤(a)中,各个发泡聚乙烯树脂颗粒的重量不小于2.5mg且不大于3.5mg, 对发泡聚乙烯树脂颗粒施加0.12MPa至0.16MPa的内部压力。
-
公开(公告)号:EP3235860A1
公开(公告)日:2017-10-25
申请号:EP15869903.3
申请日:2015-12-11
申请人: Kaneka Corporation
发明人: MIURA, Shintaro
IPC分类号: C08J9/18
CPC分类号: C08J9/18 , C08J9/0061 , C08J9/122 , C08J9/232 , C08J2203/06 , C08J2323/06 , C08J2323/08 , C08J2323/14 , C08J2323/16 , C08J2423/06 , C08J2423/14 , C08J2423/16 , C08L23/14 , C08L2205/02 , C08L23/04
摘要: With use of expanded polypropylene resin particles having, as a base material resin, a polypropylene resin composition X containing a polypropylene resin A having a low melting point, a polypropylene resin B having a high melting point, and a polyethylene resin C having a specific melting point, wherein the polypropylene resin A, the polypropylene resin B, and the polyethylene resin C are present in respective predetermined amounts, a polypropylene resin in-mold expanded molded product having a high compressive strength and an excellent appearance is produced at a decreased molding temperature during in-mold foaming molding.
摘要翻译: 通过使用以聚丙烯树脂组合物X作为基材树脂的聚丙烯系树脂组合物X,所述聚丙烯系树脂组合物X含有熔点低的聚丙烯系树脂A,熔点高的聚丙烯系树脂B,以及具有特定熔点的聚乙烯系树脂C 其中聚丙烯树脂A,聚丙烯树脂B和聚乙烯树脂C以预定量存在,在降低的模塑温度下生产具有高压缩强度和优异外观的聚丙烯树脂模内发泡成型产品 在模内发泡成型期间。
-
-
-
-
-
-
-
-
-