公开(公告)号：EP1987934B1

公开(公告)日：2018-09-26

申请号：EP08008223.3

申请日：2008-04-30

申请人： JSP CORPORATION

发明人： Tokiwa, Tomoo ,  Tsuchida, Shohei ,  Naito, Masato

IPC分类号： B29C44/14 ,  B29C44/18 ,  B29C44/44 ,  C08J9/228 ,  C08J9/232 ,  B29C49/04 ,  B29K105/04

CPC分类号： B29C44/14 ,  B29C44/18 ,  B29C49/04 ,  B29C2791/006 ,  B29K2105/04 ,  C08J9/228 ,  C08J9/232 ,  C08J2323/12 ,  C08J2423/00 ,  Y10T428/13 ,  Y10T428/1352 ,  Y10T428/1376 ,  Y10T428/249988

摘要： The present invention pertains to a skin-covered foamed molded article (22) of expanded propylene resin beads having excellent lightness in weight, mechanical properties and appearance. The present invention provides a skin-covered foamed molded article (22) of propylene resin expanded beads, with the skin covering substantially the entire surface of the molded article (20) of the expanded beads. The skin, within which the molded article (20) of expanded propylene resin beads is placed, is a propylene resin hollow molded body obtained by blow molding. A base resin of which the skin is formed comprises a propylene resin having a partial heat of fusion in a temperature range between 80 and 140°C of at least 15 J/g and a ratio of the partial heat of fusion to a total heat of fusion (partial heat of fusion/total heat of fusion) of at least 0.2 as measured by heat flux differential scanning calorimetry. The skin has a thickness in the range of 0.3 to 3.5 mm, and the molded article (20) of expanded propylene resin beads has an apparent density in the range of 0.015 to 0.15 g/cm 3 . The skin is fuse-bonded to the molded article (20) of expanded beads, and the expanded beads from which the molded article (20) is formed are fuse-bonded to each other.

公开(公告)号：EP2829582B1

公开(公告)日：2018-09-19

申请号：EP14774944.4

申请日：2014-03-20

申请人： NGK Insulators, Ltd.

发明人： MURAI, Makoto ,  NISHIO, Akifumi ,  FUJIOKA, Yasumasa ,  IWADE, Masanari

IPC分类号： B41M5/26 ,  C09D11/00 ,  C09D1/00 ,  C09D5/00 ,  C09D11/10 ,  C09D201/00 ,  B41M5/52

CPC分类号： C08J5/18 ,  B41M5/267 ,  B41M5/28 ,  B41M5/52 ,  B41M5/5218 ,  C08J9/0066 ,  C08J9/228 ,  C08J2357/00 ,  C08J2400/00 ,  C09D5/00 ,  C09D7/61 ,  C09D11/037 ,  C09D11/10

摘要： To provide a technique related to a marking base that allows clear marking by ink and is excellent in thermal resistance and chemical resistance. A marking base composition contains inorganic particles of 27 to 50 mass%, an inorganic binder of 5 to 20 mass%, an organic binder of 3 to 16 mass%, a thermal expansion resin of 1 to 3 mass%, and an organic solvent.

公开(公告)号：EP3344692A1

公开(公告)日：2018-07-11

申请号：EP16766730.2

申请日：2016-08-31

申请人： Rohm and Haas Company

发明人： PETR, Michael, T. ,  VAN RHEENEN, Paul

IPC分类号： C08K5/00 ,  C08L27/06 ,  C08F110/02 ,  C08F110/06 ,  C08F220/18

CPC分类号： C08J9/228 ,  C08F110/02 ,  C08F110/06 ,  C08F220/18 ,  C08F2220/1808 ,  C08F2220/1816 ,  C08F2800/20 ,  C08J2201/022 ,  C08J2205/08 ,  C08J2205/10 ,  C08J2327/06 ,  C08K5/00 ,  C08L27/06 ,  C08F220/14 ,  C08L33/10

摘要： A processing aid for foam molding comprising a copolymer obtained by the polymerization of from 50% to 100% by weight total of one or more monomers selected from the group consisting of ethyl methacrylate and propyl methacrylate, and 0 to 50% by weight of other copolymerizable monomers, the copolymer having the following properties: (a) a reduced viscosity measured according to ASTM D2857 at 1 mg/mL in chloroform at 25° C. of greater than 8 dL/g and (b) a Tg equal to or less than 77° C. is provided.

公开(公告)号：EP3218119A4

公开(公告)日：2018-06-20

申请号：EP15858964

申请日：2015-11-12

申请人： HANWHA AZDEL INC

发明人： TSENG YU-TSAN ,  WANG RUOMIAO ,  MASON MARK O ,  ROBERTZ TROY D ,  VORENKAMP ERICH J

IPC分类号： C08J5/10 ,  B32B27/12 ,  B32B27/14 ,  C08J5/24 ,  C08K3/04

CPC分类号： C08J9/228 ,  B29C70/00 ,  B32B5/02 ,  B32B5/18 ,  B32B5/22 ,  B32B5/245 ,  B32B5/26 ,  B32B5/32 ,  B32B27/065 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0269 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2262/103 ,  B32B2262/106 ,  B32B2262/108 ,  B32B2264/08 ,  B32B2266/0214 ,  B32B2266/06 ,  B32B2270/00 ,  B32B2307/3065 ,  B32B2605/00 ,  C08J5/043 ,  C08J5/10 ,  C08J5/24 ,  C08J9/0066 ,  C08J2205/05 ,  C08J2323/12

摘要： Prepregs, composites and articles comprising expandable graphite materials dispersed in a thermoplastic layer are described. In some instances, a thermoplastic composite article comprises a porous core layer comprising a plurality of reinforcing fibers and a thermoplastic material, and the porous core layer further comprises expandable graphite particles homogeneously dispersed in the porous core layer.

公开(公告)号：EP3199580A4

公开(公告)日：2018-05-16

申请号：EP15843592

申请日：2015-09-14

申请人： KANEKA CORP

发明人： SUZUKI KIRITO ,  TAMURA MITSUHIRO ,  HENMI TATSUYA

IPC分类号： C08J9/20 ,  B22C7/02 ,  C08F220/14 ,  C08J9/14 ,  C08J9/232 ,  C08L33/12

CPC分类号： B22C7/023 ,  C08F220/14 ,  C08J9/141 ,  C08J9/18 ,  C08J9/20 ,  C08J9/228 ,  C08J9/232 ,  C08J2201/026 ,  C08J2203/14 ,  C08J2203/182 ,  C08J2203/202 ,  C08J2207/00 ,  C08J2333/08 ,  C08J2333/12 ,  C08L33/12 ,  C08F2220/1825 ,  C08F2222/1013

摘要： The present invention addresses the problem of providing a me thyl methacrylate expanded mold article that rarely generates smoke and soot upon ignition, that can be expanded at a high expansion ra tio, and that is hardly broken upon deformation. The problem is sol ved by an expandable poly methyl methacrylate particle comprising a polymer obtained from 100 parts by weight of an acrylic monomer, a nd not less than 0.05 parts by weight and not more than 0.15 parts b y weight of a polyfunctional monomer, wherein the acrylic monomer c omprises not less than 90% by weight and not more than 98% by weight of methyl methacrylate and not less than 2% by weight and not more than 10% by weight of an C 2-8 alkyl acrylate.

公开(公告)号：EP3077451B1

公开(公告)日：2018-02-07

申请号：EP14806261.5

申请日：2014-12-03

申请人： Evonik Röhm GmbH

发明人： BERNHARD, Kay ,  LIEBL, Ina ,  HOLLEYN, Denis ,  SEIPEL, Christoph

IPC分类号： C08J9/22 ,  C08J9/04 ,  B29C44/34 ,  C08J9/232 ,  C08J9/16 ,  C08J9/20

CPC分类号： B29C44/3415 ,  B29B9/12 ,  B29C35/0805 ,  B29C44/02 ,  B29C44/3403 ,  B29C44/3461 ,  B29C44/38 ,  B29C2035/0822 ,  B29K2079/08 ,  B29K2105/048 ,  C08J3/28 ,  C08J9/04 ,  C08J9/16 ,  C08J9/20 ,  C08J9/22 ,  C08J9/224 ,  C08J9/228 ,  C08J9/232 ,  C08J2201/034 ,  C08J2205/10 ,  C08J2333/04 ,  C08J2333/18 ,  C08J2333/24

公开(公告)号：EP3250343A1

公开(公告)日：2017-12-06

申请号：EP16704084.9

申请日：2016-01-13

申请人： Cabot Microelectronics Corporation

发明人： HUANG, Ping ,  ALLISON, William C. ,  FRENTZEL, Richard ,  LEFEVRE, Paul Andre ,  KERPRICH, Robert ,  SCOTT, Diane

IPC分类号： B24B37/20 ,  B24B37/24 ,  B24B37/26

CPC分类号： B24B37/24 ,  B24B37/205 ,  B24B37/26 ,  C08J9/0061 ,  C08J9/228 ,  C08J2333/00 ,  C08J2375/04 ,  C08J2433/00 ,  C08J2475/04

摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad (222) for polishing a substrate includes a polishing body having a density approximately in the range of 0.4 - 0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores (218) dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores (218) has a shell composed of an acrylic co-polymer.

公开(公告)号：EP3055352B1

公开(公告)日：2017-09-13

申请号：EP14780809.1

申请日：2014-09-29

申请人： BASF SE

发明人： KEPPELER, Uwe

IPC分类号： C08J9/18 ,  C08J9/12 ,  C08J9/14 ,  C08J9/232 ,  C08J9/236 ,  B29C44/34

CPC分类号： C08J9/18 ,  B29C44/3453 ,  B29C44/3461 ,  C08J9/0061 ,  C08J9/0066 ,  C08J9/122 ,  C08J9/141 ,  C08J9/228 ,  C08J9/232 ,  C08J9/236 ,  C08J2201/034 ,  C08J2203/06 ,  C08J2203/14 ,  C08J2203/182 ,  C08J2205/052 ,  C08J2300/16 ,  C08J2367/02 ,  C08J2467/04

公开(公告)号：EP2561974B1

公开(公告)日：2017-05-17

申请号：EP12193618.1

申请日：2010-03-17

申请人： W.L. Gore & Associates, Inc.

发明人： Xu, Ping ,  Hegenbarth, Jack J. ,  Chen, Xin Kang

IPC分类号： B29C55/00 ,  C08F214/26 ,  C08J9/14 ,  C08J9/40

CPC分类号： C08F14/26 ,  B29C55/005 ,  B29K2027/18 ,  B29K2105/04 ,  C08F214/26 ,  C08F214/262 ,  C08J9/141 ,  C08J9/228 ,  C08J9/40 ,  C08J9/405 ,  C08J2201/03 ,  C08J2327/18 ,  C08F2/22

公开(公告)号：EP3159375A4

公开(公告)日：2017-04-26

申请号：EP15809786

申请日：2015-06-17

申请人： ASAHI KASEI CONSTRUCTION MAT CORP

发明人： MUKAIYAMA SHIGEMI ,  IHARA KEN ,  HAMAJIMA MASATO

IPC分类号： C08J9/14

CPC分类号： C08J9/141 ,  B29B7/88 ,  B29C44/10 ,  B29K2105/046 ,  B29L2007/002 ,  C08J9/0038 ,  C08J9/0066 ,  C08J9/146 ,  C08J9/149 ,  C08J9/228 ,  C08J2201/02 ,  C08J2201/026 ,  C08J2203/14 ,  C08J2203/162 ,  C08J2203/182 ,  C08J2203/202 ,  C08J2205/044 ,  C08J2205/052 ,  C08J2207/00 ,  C08J2361/04 ,  C08J2361/10

摘要： Provided is a phenol resin foam that has low initial thermal conductivity and that retains low thermal conductivity for a long period of time. The present phenol resin foam may contain a cyclopentane and a high-boiling hydrocarbon with a boiling point of from 120 °C to 550 °C and may have a density of from 10 kg/m 3 to 150 kg/m 3 . The content of the cyclopentane in the phenol resin foam per 22.4 × 10 -3 m 3 space volume in the phenol resin foam is from 0.25 mol to 0.85 mol.

摘要翻译： 本发明提供一种初始导热系数低，长时间保持低导热系数的酚醛树脂发泡体。 本发明的酚醛树脂发泡体可以含有环戊烷和沸点为120-550℃的高沸点烃，并且可以具有10kg / m 3至150kg / m 3的密度。 酚醛树脂发泡体中的22.4×10 -3 m 3空间体积中的酚醛树脂发泡体中的环戊烷的含量为0.25摩尔〜0.85摩尔。