摘要:
A space transformer (50) for electrically interconnecting a probe head to a printed circuit board, which includes a flexible multilayer circuit (54) with device under test contact pads (64) formed on a first side (58) and printed circuit board contact pads (66) formed on a second side (60). Electrically conductive circuit traces (62) extend between device under test contact pads (64) and printed circuit board contact pads (66). A shim plate (56) is fastened to a periphery of first side (58) of flexible multilayer circuit (54) and a bottom plate (52) is fastened to a periphery of second side (60) of flexible multilayer circuit (54). Bottom plate (52) has a plurality of internal apertures (72), which are aligned with printed circuit board contact pads (66) and separated by bottom plate stanchions (74), which are aligned with device under test contact pads (64). A plurality of interconnects (68) are bonded and electrically interconnected to printed circuit board contact pads (66) and extend through internal apertures (72).
摘要:
Die Erfindung betrifft eine elektrische Prüfeinrichtung für die Prüfung eines elektrischen Prüflings, mit einem Leitersubstrat, das über einen Kontaktabstandstransformer mit einem Prüfkopf elektrisch verbunden ist, wobei das Leitersubstrat mit einer ersten Versteifungseinrichtung mechanisch verbunden und dadurch versteift ist. Es ist vorgesehen, dass mindestens ein das Leitersubstrat (12) durchgreifender Abstandshalter (30) mit dem Kontaktabstandstransformer (7) mechanisch verbunden ist und an der ersten Versteifungseinrichtung (26) über Neigungseinstellmittel (34) gehalten ist.
摘要:
The invention relates to a module (1) for a parallel tester for the testing of circuit boards and a parallel tester that comprises such modules. The module comprises circuit boards (3) standing perpendicular to the plane of the base grid of the parallel tester, with contact pins (9) arranged along one side edge (4) of said circuit boards. The peripheral surfaces of the contact pins (9) lie against flat sides (5) of the circuit boards (3) and extend a bit beyond the circuit board (3) at the side edge (4). The contact pins are electrically and mechanically connected to contact fields (6) configured on the circuit board. This arrangement of contact pins (9) can be manufactured cost-effectively, is mechanically stable, and allows the manufacture of modules with a high density of contact pins (9).