公开(公告)号：EP4509571A1

公开(公告)日：2025-02-19

申请号：EP23803586.9

申请日：2023-05-10

Applicant: Resonac Corporation

Inventor： TANAKA Toru ,  KAWAMORI Takashi ,  MATSUNAGA Masahiro

IPC: C09J4/00 ,  B32B27/00 ,  C09J11/04 ,  C09J11/06

Abstract: An adhesive set is disclosed. The adhesive set includes a main agent containing a decomplexing agent and an initiator containing an organoborane complex and (meth)acrylamide having a heterocyclic ring. At least one of the main agent and the initiator further contains a compound having a radically polymerizable group. At least one of the main agent and the initiator further contains at least one selected from the group consisting of a metal halide salt and a compound having a thiocarbonyl thio structure.

公开(公告)号：EP3633830B1

公开(公告)日：2025-02-19

申请号：EP18806601.3

申请日：2018-05-16

Inventor： KUSUYAMA, Aki

IPC: B32B37/12 ,  H02K15/02 ,  B21D28/02 ,  B21D37/18 ,  C09J4/02 ,  C09J11/06 ,  B32B37/00 ,  B32B37/04 ,  C08F220/18 ,  C09J4/00 ,  B32B38/04 ,  B32B15/01 ,  B32B15/082 ,  B32B15/18 ,  B32B37/18

公开(公告)号：EP4502092A1

公开(公告)日：2025-02-05

申请号：EP23774833.0

申请日：2023-03-17

Applicant: Daicel Corporation

Inventor： TSUJI, Naoko

IPC: C09J4/00 ,  C09J201/06 ,  H01L21/02

Abstract: Provided is a temporary adhesive that has good applicability and adhesiveness and allows an adherend to be easily peeled off by a slide peeling method or a blade peeling method. The temporary adhesive of the present disclosure contains, as resin components, a polyvalent vinyl ether compound (A), a polymer (B) having a plurality of hydroxy groups and/or carboxy groups as pendant groups, and a thermoplastic resin (C). The polymer (B) has a weight average molecular weight from 1500 to 7000, the thermoplastic resin (C) has a weight average molecular weight greater than 7000, and the resin components contained in the temporary adhesive have a weight average molecular weight less than or equal to 100000. A weight average molecular weight of the resin components contained in a heat-treated product formed by heating the temporary adhesive at 230°C for 5 minutes is more than or equal to 1.2 times as great as the weight average molecular weight of the resin components contained in the temporary adhesive, the heat-treated product has a Tg higher than or equal to 100°C and lower than 200°C, and the heat-treated product has a viscosity, at 200°C and a frequency of 10 Hz, of less than or equal to 100 cP.

公开(公告)号：EP4493604A1

公开(公告)日：2025-01-22

申请号：EP23710910.3

申请日：2023-03-15

Applicant: SciGrip Adhesives Ltd.

Inventor： ELKAIM, Eric ,  RAHME, Roland

IPC: C08F220/20 ,  C08J9/08 ,  C09J4/00

公开(公告)号：EP4477710A1

公开(公告)日：2024-12-18

申请号：EP23749760.7

申请日：2023-02-01

Applicant: Namics Corporation

Inventor： YOSHII Yu

IPC: C08L35/02 ,  C08F22/14 ,  C08K3/36 ,  C09J4/00 ,  C09J135/00 ,  C09K3/10

Abstract: An object of the present invention is to provide a resin composition comprising a 2-methylene-1,3-dicarbonyl compound with improved workability.
The resin composition comprises:
(A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:

and a molecular weight of 230 ~ 1,000; and
(B) fumed silica having an average primary particle size of 1 nm ~ 50 nm and a specific surface area of 50 m 2 /g ~ 250 m 2 /g.

公开(公告)号：EP4217553B1

公开(公告)日：2024-12-18

申请号：EP21778431.3

申请日：2021-09-17

Inventor： MIKKELSEN, Anders Peter

IPC: E04G23/02 ,  C09J4/00 ,  C09J11/00 ,  B65D83/00 ,  B05C17/005

公开(公告)号：EP3603606B1

公开(公告)日：2024-11-13

申请号：EP18777195.1

申请日：2018-03-29

Inventor： KOSUGI Yoko ,  MATSUMOTO Akiko ,  YOSHINAGA Kazuhiko ,  GERLACH Michael ,  LECHMANN-DORN Maria ,  SCHNEIDER Jutta ,  UTTERODT Andreas

IPC: A61K6/30 ,  C07F9/09 ,  C09J4/00 ,  C08F222/10 ,  C09J4/06

公开(公告)号：EP4442782A1

公开(公告)日：2024-10-09

申请号：EP24163018.5

申请日：2024-03-12

Applicant: ThreeBond Co., Ltd.

Inventor： KAWAMOTO, Ippei ,  MOTOKI, Shigekazu

IPC: C09J4/00

CPC classification number: C09J4/00 ,  A61K8/34 ,  A61K8/40

Abstract: The present disclosure provides a curing accelerator that ensures curing acceleration performance while inhibiting whitening and is mildly irritating. The present disclosure relates to a method for accelerating curing of a monomer, the method including curing a monomer using a curing accelerator that contains a component (A) and a component (B) below and does not contain a solvent having a boiling point higher than 120°C:
the component (A): a solvent having 2 or more carbon atoms in one molecule and having a boiling point of 25 to 120°C; and
the component (B): water.

公开(公告)号：EP4437056A1

公开(公告)日：2024-10-02

申请号：EP22826362.0

申请日：2022-11-18

Applicant: Bostik SA ,  Centre National de la Recherche Scientifique ,  Université de Haute-Alsace

Inventor： MAZAJCZYK, Jerome ,  FOUQUAY, Stephane ,  SIMON, Frederic ,  BARRAT, Alexis ,  LALEVEE, Jacques

IPC: C09J4/00 ,  C09J133/08 ,  C09J133/14

CPC classification number: C09J4/00 ,  C09J133/08 ,  C09J133/14

公开(公告)号：EP4385529A3

公开(公告)日：2024-09-18

申请号：EP24170531.8

申请日：2019-05-02

Applicant: Femasys, Inc.

Inventor： LEE-SEPSICK, Kathy

IPC: A61B17/42 ,  A61F6/22 ,  A61F6/20 ,  A61L24/00 ,  C09J4/00 ,  A61L24/04

CPC classification number: A61F6/22 ,  A61L24/001 ,  A61L24/0042 ,  A61L24/0031 ,  A61L24/0015 ,  A61L24/046

Abstract: Disclosed herein are exemplary medical devices for controlled delivery of material compositions, particularly occlusive, therapeutic, or diagnostic compositions.