POWDER SURFACE TREATMENT PLASMA DEVICE USING FLAT FILTER ELECTRODES

    公开(公告)号:EP4252902A1

    公开(公告)日:2023-10-04

    申请号:EP21898330.2

    申请日:2021-10-06

    IPC分类号: B01J19/08 B01J19/10 H05H1/46

    摘要: A powder treatment plasma device according to the present invention maximizes processing capacity for performing processing all at once, by stacking a plurality of flat and porous filter electrodes, and thus improves processing efficiency. In addition, since vibration is applied to the filter electrodes by using a vibration generator while causing powder to be adsorbed on surfaces of the filter electrodes by using an adsorption means, the powder can be evenly dispersed on the surfaces of the filter electrodes and mixed, and thus the powder can be evenly surface-treated.